Abstract: A heat sink (1), has heat pipes (3) which are disposed in a high temperature section (A) of a base plate (2) on which a heating element (4) is disposed so that the heat pipes (3) extend from the high temperature section (A) to low temperature sections (B) in different directions.

Abstract: A heat sink (1), has heat pipes (3) which are disposed in a high temperature section (A) of a base plate (2) on which a heating element (4) is disposed so that the heat pipes (3) extend from the high temperature section (A) to low temperature sections (B) in different directions.

Abstract: A light source comprising a plurality of laser diode modules, wherein a plurality of high optical power laser diode modules are arranged in high density, each of the plurality of high optical power laser diode modules includes a metal substrate mounting a laser diode chip and an optical instrument thereon; a Peltier device thermally connected to the metal substrate; a heat pipe having a heat absorbing portion and a heat dissipating portion in which the heat absorbing portion is thermally connected to the Peltier device and a heat dissipating fin is provided on the heat dissipating portion; and a heat pipe reinforcing member to hold the heat dissipating fin and reinforce a strength of the heat pipe.

Abstract: In a light source comprising a plurality of laser diode modules, high optical power is outputted, while these laser diode modules are arranged in high density. The light source is arranged by employing a plurality of laser diode modules, the optical power of which is higher than, or equal to 300 mW.

Abstract: A light source including at least one laser diode module and a heat pipe having a heat absorbing portion and a heat radiating portion. The laser diode module includes a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with the metal substrate. The heat absorbing portion of the heat pipe is thermally connected with the peltier device. The light source preferably includes a plurality of densely placed laser diode modules, each of which has an output of at least 100 mW. The light source also preferably includes a plurality of heat pipes having heat radiating fins on the heat radiating portions thereof.

Abstract: In a light source comprising a plurality of laser diode modules, high optical power is outputted, while these laser diode modules are arranged in high density. The light source is arranged by employing a plurality of laser diode modules, the optical power of which is higher than, or equal to 300 mW.

Abstract: In a light source comprising a plurality of laser diode modules, high optical power is outputted, while these laser diode modules are arranged in high density. The light source is arranged by employing a plurality of laser diode modules, the optical power of which is higher than, or equal to 300 mW.

Abstract: In a light source comprising a plurality of laser diode modules, high optical power is outputted, while these laser diode modules are arranged in high density. The light source is arranged by employing a plurality of laser diode modules, the optical power of which is higher than, or equal to 300 mW.

Abstract: A light source comprising a plurality of laser diode modules, wherein a plurality of high optical power laser diode modules are arranged in high density, each of the plurality of high optical power laser diode modules includes a metal substrate mounting a laser diode chip and an optical instrument thereon; a Peltier device thermally connected to the metal substrate; a heat pipe having a heat absorbing portion and a heat dissipating portion in which the beat absorbing portion is thermally connected to the Peltier device and a heat dissipating fin is provided on the heat dissipating portion; and a heat pipe reinforcing member to hold the heat dissipating fin and reinforce a strength of the heat pipe.

Abstract: A light source including at least one laser diode module and a heat pipe having a heat absorbing portion and a heat radiating portion. The laser diode module includes a metal substrate mounting a laser diode chip and an optical component, and a peltier device thermally connected with the metal substrate. The heat absorbing portion of the heat pipe is thermally connected with the peltier device. The light source preferably includes a plurality of densely placed laser diode modules, each of which has an output of at least 100 mW. The light source also preferably includes a plurality of heat pipes having heat radiating fins on the heat radiating portions thereof.