Patents by Inventor Shinya Narita
Shinya Narita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11956386Abstract: An emergency report can be made to a plurality of emergency services. Provided is a communication control device 2 housing a subscriber terminal 1, and the communication control device 2 includes: a call control unit 21 that connects an emergency call made from the subscriber terminal 1 to an emergency-call reception switchboard 5; and an outgoing/incoming call inhibition unit 22 that inhibits outgoing/incoming calls from/to the subscriber terminal 1 in a prescribed period, when the emergency call is disconnected by the subscriber terminal 1. The outgoing/incoming call inhibition unit 22: when a call is made from the subscriber terminal 1 in the prescribed period, determines whether the call is an emergency call or a general call; in a case of an emergency call, cancels inhibition for outgoing/incoming calls from/to the subscriber terminal 1 and connects the call by using the call control unit 21; and in a case of a general call, does not connect the call.Type: GrantFiled: November 1, 2019Date of Patent: April 9, 2024Assignee: Nippon Telegraph and Telephone CorporationInventors: Daiki Nakajima, Taichi Osada, Mikio Isawa, Yasuhiro Seki, Hiroaki Matsumura, Shinya Narita
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Publication number: 20220006901Abstract: An emergency report can be made to a plurality of emergency services. Provided is a communication control device 2 housing a subscriber terminal 1, and the communication control device 2 includes: a call control unit 21 that connects an emergency call made from the subscriber terminal 1 to an emergency-call reception switchboard 5; and an outgoing/incoming call inhibition unit 22 that inhibits outgoing/incoming calls from/to the subscriber terminal 1 in a prescribed period, when the emergency call is disconnected by the subscriber terminal 1. The outgoing/incoming call inhibition unit 22: when a call is made from the subscriber terminal 1 in the prescribed period, determines whether the call is an emergency call or a general call; in a case of an emergency call, cancels inhibition for outgoing/incoming calls from/to the subscriber terminal 1 and connects the call by using the call control unit 21; and in a case of a general call, does not connect the call.Type: ApplicationFiled: November 1, 2019Publication date: January 6, 2022Inventors: Daiki Nakajima, Taichi Osada, Mikio Isawa, Yasuhiro Seki, Hiroaki Matsumura, Shinya Narita
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Patent number: 10358704Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 ?m and the area of a volumetric distribution of particle sizes of 45-205 ?m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.Type: GrantFiled: July 3, 2015Date of Patent: July 23, 2019Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Shinya Narita
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Patent number: 10302375Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 ?m and the area of the volumetric distribution of grain sizes of 45-205 ?m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.Type: GrantFiled: April 23, 2015Date of Patent: May 28, 2019Assignee: DENKA COMPANY LIMITEDInventors: Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto, Shinya Narita
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Patent number: 9745754Abstract: A snow guard structure has the configuration in which a first frame body holding a ridge-side end side of a solar cell panel and a second frame body holding an eaves-side end side of an adjacent solar cell panel are fixed to a roof surface such that spaces are formed under their bottom face portions, and a snow guard fitting includes an upper abutment piece abutting against upper face portions of the two frame bodies, a lower abutment piece abutting against bottom face portions of the two frame bodies, an external thread member extending upward from the lower abutment piece and penetrating through the upper abutment piece and fastening the upper abutment piece and the lower abutment piece by screwing with an internal thread between the two frame bodies, and a snow guard portion extending upward from the upper abutment piece.Type: GrantFiled: September 21, 2016Date of Patent: August 29, 2017Assignee: Yanegijutsukenkyujo Co., Ltd.Inventor: Shinya Narita
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Publication number: 20170130300Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 ?m and the area of a volumetric distribution of particle sizes of 45-205 ?m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.Type: ApplicationFiled: July 3, 2015Publication date: May 11, 2017Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Shinya NARITA
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Publication number: 20170045314Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 ?m and the area of the volumetric distribution of grain sizes of 45-205 ?m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.Type: ApplicationFiled: April 23, 2015Publication date: February 16, 2017Applicant: DENKA COMPANY LIMITEDInventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Hideo TSUKAMOTO, Shinya NARITA
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Patent number: 8883564Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.Type: GrantFiled: February 8, 2010Date of Patent: November 11, 2014Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
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Patent number: 8546842Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.Type: GrantFiled: July 16, 2010Date of Patent: October 1, 2013Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
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Publication number: 20120112236Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.Type: ApplicationFiled: July 16, 2010Publication date: May 10, 2012Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
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Publication number: 20110316038Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.Type: ApplicationFiled: February 8, 2010Publication date: December 29, 2011Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
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Publication number: 20090243915Abstract: A microwave sensor apparatus according to an embodiment of the invention includes a reception detection circuit which amplifies a microwave received through a reception antenna, performs wave detection, and supplies a reception detection signal, a monitoring unit for monitoring the reception detection signal supplied from the reception detection circuit, detecting that the reception detection signal is changed not lower than a predetermined value, and supplying an intrusion alarm, a reflected wave detection unit which detects presence or absence of a reflected wave in the detection area using the reception detection signal supplied from the reception detection circuit, and an AGC circuit which controls a gain of the reception detection circuit at a response speed faster than that of the case in which reflected wave is not detected when the reflected wave detection unit detects the reflected wave.Type: ApplicationFiled: September 15, 2008Publication date: October 1, 2009Inventors: Yoshiteru Nishizato, Shinya Narita