Patents by Inventor Shinya Narita

Shinya Narita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200163208
    Abstract: A flexible connector comprises a first plurality of pads disposed within an integrated circuit (IC) area, a second plurality of pads disposed in the IC area, and a plurality of through holes disposed in the IC area. The flexible connector further comprises first wiring coupled to the plurality of through holes and the first plurality of pads, and a rigidity element at least partially disposed between the plurality of through holes and the second plurality of pads.
    Type: Application
    Filed: November 20, 2019
    Publication date: May 21, 2020
    Inventors: Shinya SUZUKI, Naoyuki NARITA, Tsuyoshi KOGA, Yuichi NAKAGOMI
  • Patent number: 10358704
    Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 ?m and the area of a volumetric distribution of particle sizes of 45-205 ?m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.
    Type: Grant
    Filed: July 3, 2015
    Date of Patent: July 23, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Yosuke Ishihara, Takeshi Miyakawa, Shinya Narita
  • Patent number: 10302375
    Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 ?m and the area of the volumetric distribution of grain sizes of 45-205 ?m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: May 28, 2019
    Assignee: DENKA COMPANY LIMITED
    Inventors: Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto, Shinya Narita
  • Patent number: 9745754
    Abstract: A snow guard structure has the configuration in which a first frame body holding a ridge-side end side of a solar cell panel and a second frame body holding an eaves-side end side of an adjacent solar cell panel are fixed to a roof surface such that spaces are formed under their bottom face portions, and a snow guard fitting includes an upper abutment piece abutting against upper face portions of the two frame bodies, a lower abutment piece abutting against bottom face portions of the two frame bodies, an external thread member extending upward from the lower abutment piece and penetrating through the upper abutment piece and fastening the upper abutment piece and the lower abutment piece by screwing with an internal thread between the two frame bodies, and a snow guard portion extending upward from the upper abutment piece.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: August 29, 2017
    Assignee: Yanegijutsukenkyujo Co., Ltd.
    Inventor: Shinya Narita
  • Publication number: 20170130300
    Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 ?m and the area of a volumetric distribution of particle sizes of 45-205 ?m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.
    Type: Application
    Filed: July 3, 2015
    Publication date: May 11, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Shinya NARITA
  • Publication number: 20170045314
    Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 ?m, and a second peak lies at 55-195 ?m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 ?m and the area of the volumetric distribution of grain sizes of 45-205 ?m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.
    Type: Application
    Filed: April 23, 2015
    Publication date: February 16, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yosuke ISHIHARA, Takeshi MIYAKAWA, Hideo TSUKAMOTO, Shinya NARITA
  • Patent number: 8883564
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Patent number: 8546842
    Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: October 1, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
  • Publication number: 20120112236
    Abstract: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.
    Type: Application
    Filed: July 16, 2010
    Publication date: May 10, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Satoshi Higuma, Hideki Hirotsuru, Shinya Narita
  • Publication number: 20110316038
    Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.
    Type: Application
    Filed: February 8, 2010
    Publication date: December 29, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hideki Hirotsuru, Satoshi Higuma, Shinya Narita, Yoshihiko Tsujimura
  • Publication number: 20090243915
    Abstract: A microwave sensor apparatus according to an embodiment of the invention includes a reception detection circuit which amplifies a microwave received through a reception antenna, performs wave detection, and supplies a reception detection signal, a monitoring unit for monitoring the reception detection signal supplied from the reception detection circuit, detecting that the reception detection signal is changed not lower than a predetermined value, and supplying an intrusion alarm, a reflected wave detection unit which detects presence or absence of a reflected wave in the detection area using the reception detection signal supplied from the reception detection circuit, and an AGC circuit which controls a gain of the reception detection circuit at a response speed faster than that of the case in which reflected wave is not detected when the reflected wave detection unit detects the reflected wave.
    Type: Application
    Filed: September 15, 2008
    Publication date: October 1, 2009
    Inventors: Yoshiteru Nishizato, Shinya Narita