Abstract: A mounting system including: a storage that stores plural formats for each substrate including divisional information of a mounting apparatus indicating which of plural mounting apparatuses that divisionally mount plural electronic components on a substrate mounts what electronic component on the substrate and information on a deviation amount of an electronic component indicating how much each of the electronic components mounted on the substrate and inspected by an inspection apparatus is deviated from its regular position; and a controller that changes, according to a change of an assignment of mounting, the divisional information in a format corresponding to the substrate for which the assignment has been changed, and controls the mounting apparatus that has mounted the electronic component and has been specified from the mounting apparatuses to mount the electronic component on the substrate after correcting a deviation amount based on the information on a deviation amount.

Abstract: A mounting system including: a storage that stores plural formats for each substrate including divisional information of a mounting apparatus indicating which of plural mounting apparatuses that divisionally mount plural electronic components on a substrate mounts what electronic component on the substrate and information on a deviation amount of an electronic component indicating how much each of the electronic components mounted on the substrate and inspected by an inspection apparatus is deviated from its regular position; and a controller that changes, according to a change of an assignment of mounting, the divisional information in a format corresponding to the substrate for which the assignment has been changed, and controls the mounting apparatus that has mounted the electronic component and has been specified from the mounting apparatuses to mount the electronic component on the substrate after correcting a deviation amount based on the information on a deviation amount.

Abstract: Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (1) for a semiconductor device comprises: a plurality of columnar members (13) joined onto at least one of surfaces of a plate-like member (11, 12) by stud welding; and a joining layer (14) formed between the plate-like member (11, 12) and the columnar members (13). The plate-like member (11, 12) includes a base material (11) and surface layers (12). The surface layers (12) and the columnar members (13) are made of a material containing aluminum or an aluminum alloy. A thickness of the plate-like member (11, 12) is 0.5 mm through 6 mm and a thickness of each of the surface layers (12) is 0.

Abstract: A chemical treatment method in which an object to be treated is treated with a chemical treating agent to form a chemical conversion coating, in which the object to be treated has at least one aluminum-plated steel sheet and at least one member selected from the group consisting of cold-rolled steel sheets, zinc-plated steel sheets, and aluminum sheets and the chemical treating agent is one which has zirconium, fluorine, and an aminated silane coupling agent and in which the zirconium content is 100-700 ppm in terms of metal amount and the fluorine/zirconium ratio is 3.5-7.0 by mole. A sufficient coating amount can be ensured on the surface of a zinc deposit, cold-rolled steel sheet, zinc-plated steel sheet, aluminum-plated steel sheet, or the like and a chemical conversion coating having sufficient base-hiding properties and sufficient adhesion can be formed.

Abstract: It is an object of the invention to provide a chemical conversion treating agent containing no chromium and exhibiting high corrosion resistance and excellent stability. A chemical conversion treating agent comprising: zirconium; fluorine; (A) at least one compound selected from the group consisting of amino group-containing silane coupling agents, their hydrolyzed products, and their polymers; and (B) an amino group-containing water-borne phenol compound; wherein the content of zirconium in the chemical conversion treating agent is 25 to 2000 ppm on the metal equivalent basis, and the mole ratio of the contents of fluorine and zirconium satisfies the following relation: 3?F/Zr?6.

Abstract: The present invention provides an economical package for housing semiconductor chip that allows a semiconductor chip to operate normally and stably over long periods by efficiently transferring heat generated during the operation of the semiconductor chip to the package mount substrate.