Patents by Inventor Shinya Nishikawa

Shinya Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060121249
    Abstract: Disclosed herein is a plated-polyester article with a plating layer formed on the surface of a polyester article. The polyester article is irradiated with ionizing radiation to crosslink a polyester resin, the arithmetic mean roughness Ra of the surface of the plating layer is at most 1 ?m, and adhesion strength between the polyester article and the plating layer is at least 2 MPa. A production process of a plated-polyester article, which comprises the step of melt-forming a resin composition obtained by dispersing an inorganic filler having an average particle diameter of 1 to 10 ?m in a proportion of 5 to 20 vol. % in a polyester resin, which can be crosslinked by irradiation with ionizing radiation, into a polyester article, is also disclosed.
    Type: Application
    Filed: September 9, 2003
    Publication date: June 8, 2006
    Applicant: SUMITOMO ELECTRIC INDUSTRIES LTD
    Inventors: Koji Muto, Hiroshi Hayami, Yoshito Sakamoto, Shinya Nishikawa, Shohei Okabe
  • Patent number: 6887539
    Abstract: The present invention improves the concentricity after expansion process of a heat shrinkable tube which is required to have a thin wall and hardness, and further aims to obtain elongation of 100% or more in a heat aging test, copperstability test, and heat shock test. The heat shrinkable tube satisfying such aim uses a medium- or high-density polyethylene that has a molecular weight distribution (Mw/Mn) of 30 to 55, an MFR of 0.05 to 0.2, and a specific gravity of 0.94 to 0.96. A medium- or high-density polyethylene obtained by combining an ethylene-vinyl acetate copolymer, ethylene-ethylacrylate copolymer, ethylene-methylacrylate copolymer, and ethylene-ethylmethacrylate copolymer may be used. More preferably, for an antioxidant, phenol-based and sulfur-based antioxidants are used together and zinc oxide is added.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: May 3, 2005
    Assignee: Sumitomo Electric Fine Polymer, Inc.
    Inventors: Koji Muto, Taro Fujita, Shinya Nishikawa, Hiroshi Hayami
  • Patent number: 6673867
    Abstract: A heat-resistant engineering-plastic composition that satisfies a soldering-heat resistance of 260° C. for 10 to 60 secs., that is less costly, that is free of problems in injection molding process, and that is excellent in heat-aging resistance. A heat-resistant molded product made with the heat-resistant engineering-plastic composition, such as a connector mounted on printed circuit board. The heat-resistant molded product is produced by (a) melt-kneading (a1) an engineering plastic either having or introduced an active site for reacting with a specific functional group and (a2) either an organic compound that has both the said specific functional group and a polymerizing functional group in the same molecule or polyolefin that has the said specific functional group described in (a1) to obtain a resin composition, (b) melt-molding the resin composition comprising of (a), and (c) irradiating the melt-molded resin composition with ionizing radiation.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: January 6, 2004
    Assignee: Sumitomo Electric Fine Polymer, Inc.
    Inventors: Hiroshi Hayami, Shinya Nishikawa
  • Publication number: 20030026926
    Abstract: The present invention improves the concentricity after expansion process of a heat shrinkable tube which is required to have a thin wall and hardness, and further aims to obtain elongation of 100% or more in a heat aging test, copper stability test, and heat shock test. The heat shrinkable tube satisfying such aim uses a medium- or high-density polyethylene that has a molecular weight distribution (Mw/Mn) of 30 to 55, an MFR of 0.05 to 0.2, and a specific gravity of 0.94 to 0.96. A medium- or high-density polyethylene obtained by combining an ethylene-vinyl acetate copolymer, ethylene-ethylacrylate copolymer, ethylene-methylacrylate copolymer, and ethylene-ethylmethacrylate copolymer may be used. More preferably, for an antioxidant, phenol-based and sulfur-based antioxidants are used together and zinc oxide is added.
    Type: Application
    Filed: July 17, 2002
    Publication date: February 6, 2003
    Applicant: Sumitomo Electric Fine Polymer, Inc.
    Inventors: Koji Muto, Taro Fujita, Shinya Nishikawa, Hiroshi Hayami
  • Patent number: 6306954
    Abstract: A hot-melt adhesive comprises a resin composition comprising (a) from 0.1 to 50 parts by weight of a polyolefin resin obtained by copolymerizing 80% by weight or more of a non-polar &agr;-olefin with 20% by weight or less in total of a monomer containing 5% by weight or more of a carboxyl group and a polar &agr;-olefin, or with 20% by weight or less in total of a monomer containing 0.5% by weight or more of an acid anhydride group and a polar &agr;-olefin, (b) from 0 to 80 parts by weight of a copolymer of ethylene and a non-polar&agr;-olefin, or a polyolefin resin containing 20% by weight or less of a polar &agr;-olefin, and (c) from 10 to 90 parts by weight of a polyamide, provided that the total amount of the components (a), (b) and (c) is 100 parts by weight, the resin composition having a melt index of 5 g/10 min or more and less than 500 g/10 min. The hot-melt adhesive resin composition of the invention has excellent adhesiveness to both non-polar and polar adherends.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: October 23, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shinya Nishikawa, Hiroshi Hayami, Kiyoaki Moriuchi, Akira Nishimura
  • Patent number: 6239377
    Abstract: An insulated wire including a conductor having a diameter of 1 mm or less and a foamed-polyolefin insulation layer of 2 mm or less in thickness, the insulation layer having an equivalent dielectric constant of less than 1.45 and a sidewall-pressure deformation of 20% or less. The polyolefin used is made of a mixture having an ionomer/polypropylene weight ratio between 20:80 and 80:20. The insulated wire may have, in addition to the foamed insulation layer, an outer solid insulation layer mainly consisting of polyolefin other than that used as the foamed insulation layer. In addition the insulated wire may have an inner solid insulation layer including polyethylene or acid-denaturated polyethylene.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: May 29, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Shinya Nishikawa
  • Patent number: 5573822
    Abstract: A crosslinked tube and heat-shrinkable tube, which each comprises an ionomer resin composition layer, the ionomer resin composition layer comprising (a) an ionomer resin having a structure in which a copolymer of ethylene and acrylic or methacrylic acid has been intermolecularly crosslinked with potassium ions and (b) an ionomer resin having a structure in which a copolymer of ethylene and acrylic or methacrylic acid has been intermolecularly crosslinked with sodium ions or/and zinc ions, the proportion of the ionomer resin (a) to the ionomer resin (b) being from 100/0 to 50/50 by weight. A heat-shrinkable tube, which comprises the ionomer resin composition layer having on the inner surface thereof an adhesive layer.
    Type: Grant
    Filed: January 26, 1995
    Date of Patent: November 12, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Shinya Nishikawa, Hiroshi Hayami