Patents by Inventor Shinya Onodera

Shinya Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230377802
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Applicant: TDK CORPORATION
    Inventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
  • Patent number: 11763996
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: September 19, 2023
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Koki Ito, Hideki Kaneko
  • Publication number: 20230154683
    Abstract: An electronic component includes an element body, a plurality of external electrodes on the element body, and an electrical insulator on the element body. Each of the plurality of external electrodes includes a conductive resin layer. The electrical insulator includes an electrical insulating portion located at least on a region between the plurality of external electrodes on a surface of the element body.
    Type: Application
    Filed: September 16, 2022
    Publication date: May 18, 2023
    Applicant: TDK CORPORATION
    Inventors: Kyohei TAKATA, Shinya ONODERA, Ken MORITA
  • Patent number: 11594378
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: February 28, 2023
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Koki Ito, Hideki Kaneko
  • Patent number: 11594379
    Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: February 28, 2023
    Assignee: TDK CORPORATION
    Inventors: Akihiro Masuda, Shinya Ito, Norihisa Ando, Tomoyuki Sasaki, Shinya Onodera
  • Publication number: 20220375689
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Application
    Filed: August 4, 2022
    Publication date: November 24, 2022
    Applicant: TDK CORPORATION
    Inventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
  • Patent number: 11508520
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a surface partially provided with a resin lump including an electrically insulating resin. The resin lump includes a surface exposed from the plating layer.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: November 22, 2022
    Assignee: TDK CORPORATION
    Inventor: Shinya Onodera
  • Publication number: 20220208474
    Abstract: An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 30, 2022
    Applicant: TDK CORPORATION
    Inventors: Shinya ONODERA, Akitoshi YOSHII, Kyohei TAKATA
  • Publication number: 20220157533
    Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.
    Type: Application
    Filed: October 5, 2021
    Publication date: May 19, 2022
    Applicant: TDK CORPORATION
    Inventors: Akihiro MASUDA, Shinya ITO, Norihisa ANDO, Tomoyuki SASAKI, Shinya ONODERA
  • Patent number: 11335505
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
  • Patent number: 11328866
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 10, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11289271
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 29, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Publication number: 20220084753
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Application
    Filed: November 10, 2021
    Publication date: March 17, 2022
    Applicant: TDK CORPORATION
    Inventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
  • Patent number: 11264171
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Patent number: 11264172
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: March 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Koki Ito, Hideki Kaneko
  • Patent number: 11232910
    Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: January 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Koki Ito, Hideki Kaneko
  • Patent number: 11217391
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 4, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Publication number: 20210398747
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a surface partially provided with a resin lump including an electrically insulating resin. The resin lump includes a surface exposed from the plating layer.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 23, 2021
    Applicant: TDK CORPORATION
    Inventor: Shinya ONODERA
  • Patent number: 11152154
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: October 19, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11094465
    Abstract: An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: August 17, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Ken Morita