Patents by Inventor Shinya Onodera
Shinya Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230377802Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: ApplicationFiled: August 4, 2023Publication date: November 23, 2023Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
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Patent number: 11763996Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: GrantFiled: August 4, 2022Date of Patent: September 19, 2023Assignee: TDK CORPORATIONInventors: Shinya Onodera, Koki Ito, Hideki Kaneko
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Publication number: 20230154683Abstract: An electronic component includes an element body, a plurality of external electrodes on the element body, and an electrical insulator on the element body. Each of the plurality of external electrodes includes a conductive resin layer. The electrical insulator includes an electrical insulating portion located at least on a region between the plurality of external electrodes on a surface of the element body.Type: ApplicationFiled: September 16, 2022Publication date: May 18, 2023Applicant: TDK CORPORATIONInventors: Kyohei TAKATA, Shinya ONODERA, Ken MORITA
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Patent number: 11594378Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: GrantFiled: November 10, 2021Date of Patent: February 28, 2023Assignee: TDK CORPORATIONInventors: Shinya Onodera, Koki Ito, Hideki Kaneko
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Patent number: 11594379Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.Type: GrantFiled: October 5, 2021Date of Patent: February 28, 2023Assignee: TDK CORPORATIONInventors: Akihiro Masuda, Shinya Ito, Norihisa Ando, Tomoyuki Sasaki, Shinya Onodera
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Publication number: 20220375689Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: ApplicationFiled: August 4, 2022Publication date: November 24, 2022Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
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Patent number: 11508520Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a surface partially provided with a resin lump including an electrically insulating resin. The resin lump includes a surface exposed from the plating layer.Type: GrantFiled: May 26, 2021Date of Patent: November 22, 2022Assignee: TDK CORPORATIONInventor: Shinya Onodera
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Publication number: 20220208474Abstract: An external electrode is disposed on an end of the element body in the first direction. The external electrode includes a pair of first electrode portions disposed on the pair of second side surfaces and including a conductive resin layer. Each of the pair of second side surfaces includes a region exposed from the external electrode. An insulating film is disposed on the element body. The insulating film includes film portions disposed on the pair of second side surfaces. Each of the film portions covers an edge of the conductive resin layer and the region of each of the second side surfaces along the edge of the conductive resin layer.Type: ApplicationFiled: December 22, 2021Publication date: June 30, 2022Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Akitoshi YOSHII, Kyohei TAKATA
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Publication number: 20220157533Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.Type: ApplicationFiled: October 5, 2021Publication date: May 19, 2022Applicant: TDK CORPORATIONInventors: Akihiro MASUDA, Shinya ITO, Norihisa ANDO, Tomoyuki SASAKI, Shinya ONODERA
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Patent number: 11335505Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.Type: GrantFiled: December 23, 2019Date of Patent: May 17, 2022Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
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Patent number: 11328866Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.Type: GrantFiled: March 16, 2020Date of Patent: May 10, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Patent number: 11289271Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.Type: GrantFiled: August 6, 2020Date of Patent: March 29, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Publication number: 20220084753Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: ApplicationFiled: November 10, 2021Publication date: March 17, 2022Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Koki ITO, Hideki KANEKO
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Patent number: 11264171Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.Type: GrantFiled: August 6, 2020Date of Patent: March 1, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Patent number: 11264172Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: GrantFiled: September 20, 2017Date of Patent: March 1, 2022Assignee: TDK CORPORATIONInventors: Shinya Onodera, Koki Ito, Hideki Kaneko
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Patent number: 11232910Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.Type: GrantFiled: September 20, 2017Date of Patent: January 25, 2022Assignee: TDK CORPORATIONInventors: Shinya Onodera, Koki Ito, Hideki Kaneko
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Patent number: 11217391Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.Type: GrantFiled: March 16, 2020Date of Patent: January 4, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Publication number: 20210398747Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a surface partially provided with a resin lump including an electrically insulating resin. The resin lump includes a surface exposed from the plating layer.Type: ApplicationFiled: May 26, 2021Publication date: December 23, 2021Applicant: TDK CORPORATIONInventor: Shinya ONODERA
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Patent number: 11152154Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.Type: GrantFiled: March 16, 2020Date of Patent: October 19, 2021Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
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Patent number: 11094465Abstract: An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.Type: GrantFiled: January 17, 2019Date of Patent: August 17, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita