Patents by Inventor Shinya OSAWA

Shinya OSAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220118552
    Abstract: Irradiation with a laser beam is performed along a welding bead, while the laser beam is aimed, as an irradiation point of the laser beam, at a contact point between a deck plate and a U-rib that is contained in a non-welded portion of a root part, from a side of the welding bead of the root part. Thereby, it is possible to remove a crack beginning at the non-welded portion of the root part generated at a joining portion between the deck plate and the U-rib of a steel floor slab, by the irradiation with the laser beam.
    Type: Application
    Filed: December 28, 2021
    Publication date: April 21, 2022
    Applicants: IHI INFRASTRUCTURE SYSTEMS CO., LTD., IHI CORPORATION
    Inventors: Naoyuki MATSUMOTO, Yoshihiko NAKAMURA, Shinya OSAWA, Koutarou INOSE, Junko YAMADA, Daiki OKITA, Akira KATOU