Abstract: The present invention provides pharmaceutical compositions comprising second-generation molecules that are superior than TOCILIZUMAB, by altering the amino acid sequences of the variable and constant regions of TOCILIZUMAB, which is a humanized anti-IL-6 receptor IgG1 antibody, to enhance the antigen-neutralizing ability and increase the pharmacokinetics, so that the therapeutic effect is exerted with a less frequency of administration, and the immunogenicity, safety and physicochemical properties (stability and homogeneity) are improved. The present invention also provides methods for producing these pharmaceutical compositions. The present inventors have successfully generated second-generation molecules that are superior to TOCILIZUMAB by appropriately combining amino acid sequence alterations in the CDR domains, variable regions, and constant regions.

Abstract: A poultry leg meat deboning device is configured to perform a separation of a meat part from a femur with respect to a poultry leg meat to which a peeling off of the meat part has been performed until a side of a knee joint of the femur in a bone-in poultry leg meat which has been cut from a femur of a poultry carcass. The poultry leg meat deboning device includes: an ankle holding part configured to hold an ankle of the poultry leg meat.

Abstract: A method of manufacturing a coil includes: a planar coil forming step of winding a conductor wire in a plurality of layers (or a plurality of rows and a plurality of layers) to form an air-core planar coil; a first heating step of heating the planar coil formed in the planar coil forming step to a predetermined temperature; a bending step of bending at least a part of the planar coil heated in the first heating step at a predetermined angle in a direction vertical to a plane of the planar coil; and a second heating step of heating a bent coil formed in the bending step at a predetermined temperature for a predetermined time.

Abstract: A fastener tape includes a first side-edge portion including a core cord and a plurality of first ground warp yarns; and a tape main portion adjacently positioned to the first side-edge portion and including a plurality of second ground warp yarns. A weft yarn and every ground warp yarn of the fastener tape are yarns including plant-derived resin. The first ground warp yarn is FDY (Fully Drawn Yarn) and the second ground warp yarn is DTY (Drawn Textured Yarn) and in accordance with this difference in yarn type, a thermal shrinkage ratio of the first ground warp yarn is greater than a thermal shrinkage ratio of the second ground warp yarn.

Abstract: A product conveyance robot includes: a travel portion configured to travel on a road surface; a holding portion provided above the travel portion and configured to hold a product, the holding portion being provided rotatably around a lateral turn axis extending in the height direction of the holding portion; and a controller configured to control driving of the travel portion and a rotation angle of the holding portion around the lateral turn axis.

Abstract: A fastener tape includes a first side-edge portion including a core cord and a plurality of first ground warp yarns; and a tape main portion adjacently positioned to the first side-edge portion and including a plurality of second ground warp yarns. A weft yarn and every ground warp yarn of the fastener tape are yarns including plant-derived resin. The first ground warp yarn is FDY (Fully Drawn Yarn) and the second ground warp yarn is DTY (Drawn Textured Yarn) and in accordance with this difference in yarn type, a thermal shrinkage ratio of the first ground warp yarn is greater than a thermal shrinkage ratio of the second ground warp yarn.

Abstract: A semiconductor device includes: a semiconductor substrate having a diode formation region; an upper diffusion region of a first conductivity type provided on a surface layer of a main surface of the semiconductor substrate in the diode formation region; and a lower diffusion region of a second conductivity type provided at a position deeper than the upper diffusion region with respect to the main surface in a depth direction of the semiconductor substrate, the lower diffusion region having a higher impurity concentration as compared to the semiconductor substrate. The lower diffusion region provides a PN joint surface with the upper diffusion region at a position deeper than the main surface, and has a maximum point indicating a maximum concentration in an impurity concentration profile of the lower diffusion region in the diode formation region.

Abstract: A product conveyance robot includes: a travel portion configured to travel on a road surface; a holding portion provided above the travel portion and configured to hold a product, the holding portion being provided rotatably around a lateral turn axis extending in the height direction of the holding portion; and a controller configured to control driving of the travel portion and a rotation angle of the holding portion around the lateral turn axis.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing productivity of the interdental cleaning tool, and provided is a method for manufacturing the interdental cleaning tool.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing productivity of the interdental cleaning tool.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing the productivity of the interdental cleaning tool, and provided is a method for manufacturing the interdental cleaning tool. A plurality of cleaning portion recesses (14) which penetrate a cleaning soft portion (21) and form recesses (14a) in a core base portion (12) are formed on each of a first side portion and a second side portion of a cleaning portion (2) at an interval in an axial direction of a cleaning soft portion (21), and at least one of the plurality of cleaning portion recesses (14) is formed so that an opening of the core base portion recess formed in the core base portion has a shape elongated in the axial direction of the cleaning portion.

Abstract: A semiconductor device configures a protection element that protects a protection target element connected between a cathode electrode and an anode electrode when a parasitic transistor configured by a cathode region, a first conductivity type well layer, and a second conductivity type well is turned on and electrical continuity is established between the cathode electrode and the anode electrode. The semiconductor device includes a plurality of body regions in one cell of the protection element, and the plurality of body regions is brought in contact with the cathode electrode.

Abstract: A buried n-type region is provided in a surface layer portion of an n-type body layer of a Pch MOSFET. This makes it possible to lower the threshold voltage Vt. In a portion of the n-type body layer other than the buried n-type region, since an n-type impurity concentration can be kept relatively high, the threshold voltage Vt can be lowered while securing an on-breakdown voltage. Furthermore, since an accumulation region is configured by an n-type active layer, a partial high concentration portion is not formed in a p-type drift layer. Therefore, as in the case where the partial high concentration portion is generated in the p-type drift layer, a reduction in a breakdown voltage caused by an electric field concentration can be restricted from occurring with a distribution in which equipotential lines are concentrated.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing productivity of the interdental cleaning tool, and provided is a method for manufacturing the interdental cleaning tool.

Abstract: A buried n-type region is provided in a surface layer portion of an n-type body layer of a Pch MOSFET. This makes it possible to lower the threshold voltage Vt. In a portion of the n-type body layer other than the buried n-type region, since an n-type impurity concentration can be kept relatively high, the threshold voltage Vt can be lowered while securing an on-breakdown voltage. Furthermore, since an accumulation region is configured by an n-type active layer, a partial high concentration portion is not formed in a p-type drift layer. Therefore, as in the case where the partial high concentration portion is generated in the p-type drift layer, a reduction in a breakdown voltage caused by an electric field concentration can be restricted from occurring with a distribution in which equipotential lines are concentrated.

Abstract: A semiconductor device configures a protection element that protects a protection target element connected between a cathode electrode and an anode electrode when a parasitic transistor configured by a cathode region, a first conductivity type well layer, and a second conductivity type well is turned on and electrical continuity is established between the cathode electrode and the anode electrode. The semiconductor device includes a plurality of body regions in one cell of the protection element, and the plurality of body regions is brought in contact with the cathode electrode.

Abstract: A semiconductor device includes: a semiconductor substrate having a diode formation region; an upper diffusion region of a first conductivity type provided on a surface layer of a main surface of the semiconductor substrate in the diode formation region; and a lower diffusion region of a second conductivity type provided at a position deeper than the upper diffusion region with respect to the main surface in a depth direction of the semiconductor substrate, the lower diffusion region having a higher impurity concentration as compared to the semiconductor substrate. The lower diffusion region provides a PN joint surface with the upper diffusion region at a position deeper than the main surface, and has a maximum point indicating a maximum concentration in an impurity concentration profile of the lower diffusion region in the diode formation region.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing productivity of the interdental cleaning tool.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing productivity of the interdental cleaning tool, and provided is a method for manufacturing the interdental cleaning tool.

Abstract: Provided is an interdental cleaning tool which has a simple configuration and can effectively prevent an occurrence of breakage of a core base portion when inserting the interdental cleaning tool into an interdental space or during interdental cleaning without reducing the productivity of the interdental cleaning tool, and provided is a method for manufacturing the interdental cleaning tool. A plurality of cleaning portion recesses (14) which penetrate a cleaning soft portion (21) and form recesses (14a) in a core base portion (12) are formed on each of a first side portion and a second side portion of a cleaning portion (2) at an interval in an axial direction of a cleaning soft portion (21), and at least one of the plurality of cleaning portion recesses (14) is formed so that an opening of the core base portion recess formed in the core base portion has a shape elongated in the axial direction of the cleaning portion.