Patents by Inventor Shinya Shimamura

Shinya Shimamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing same
    Patent number: 11264313
    Abstract: A semiconductor device includes a molded body and an interconnection layer. The molded body includes a semiconductor chip, at least one terminal body disposed around the semiconductor chip and a resin member provided between the semiconductor chip and the terminal body. The molded body has a first surface, a second surface opposite to the first surface and a side surface connected to the first and second surfaces. The interconnection layer is provided on the first surface of the molded body. The interconnection layer includes an interconnect electrically connecting the semiconductor chip and the terminal body. The terminal body has first and second contact surfaces. The first contact surface is exposed at the first or second surface of the molded body. The second contact surface is connected to the first contact surface and exposed at the side surface of the molded body.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: March 1, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Akito Shimizu, Yasuhisa Shintoku, Yoshihisa Imori, Hiroaki Kishi, Atsushi Hosokawa, Tomohiko Imada, Shinya Shimamura
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20200083150
    Abstract: A semiconductor device includes a molded body and an interconnection layer. The molded body includes a semiconductor chip, at least one terminal body disposed around the semiconductor chip and a resin member provided between the semiconductor chip and the terminal body. The molded body has a first surface, a second surface opposite to the first surface and a side surface connected to the first and second surfaces. The interconnection layer is provided on the first surface of the molded body. The interconnection layer includes an interconnect electrically connecting the semiconductor chip and the terminal body. The terminal body has first and second contact surfaces. The first contact surface is exposed at the first or second surface of the molded body. The second contact surface is connected to the first contact surface and exposed at the side surface of the molded body.
    Type: Application
    Filed: February 1, 2019
    Publication date: March 12, 2020
    Inventors: Akito Shimizu, Yasuhisa Shintoku, Yoshihisa Imori, Hiroaki Kishi, Atsushi Hosokawa, Tomohiko Imada, Shinya Shimamura