Patents by Inventor Shinya Tateda

Shinya Tateda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030064216
    Abstract: Graphitized carbon powder are produced by carbonizing and expanding a pitch by heating to form carbonaceous foam and by graphitizing before pulverizing or graphitizing after pulverizing the carbonaceous foam. The resultant graphitized carbon powders have an interplanar spacing (d002) of graphite planes of less than 0.3370 nm. The powders preferably have an average particle size of from 2 to 200 &mgr;m. A thermally conductive composition includes the graphitized carbon powders in a matrix. The content of the powders is preferably 1 to 800 parts by weight relative to 100 parts by weight of the matrix. Thus, the graphitized carbon powders that have excellent thermal conductivity and a thermally conductive composition including such powders are provided.
    Type: Application
    Filed: September 26, 2002
    Publication date: April 3, 2003
    Inventors: Masayuki Tobita, Naoyuki Shimoyama, Shinya Tateda
  • Publication number: 20020197923
    Abstract: A thermally conductive molded article is produced by molding a conductive composition into a predetermined shape. The composition includes a polymer matrix and carbon powders. The carbon powders are obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating. The carbon powders are aligned in a certain direction in the polymer matrix. Thus, the molded article can be produced easily and effectively that has excellent thermal conductivity in a given direction and that is suitable for use as a heat radiator, heat transfer member, or a component thereof in electronic hardware.
    Type: Application
    Filed: June 4, 2002
    Publication date: December 26, 2002
    Inventors: Masayuki Tobita, Naoyuki Shimoyama, Shinya Tateda
  • Publication number: 20020058743
    Abstract: A thermally conductive polymer composition includes polymer matrix such as thermoplastic resin or thermoplastic elastomer and a graphitized carbon fiber which serves as a thermally conductive filler. The graphitized carbon fiber is made from a mesophase pitch. The mesophase pitch is spun, infusibilized, carbonized, pulverized, and graphitized to form powdery graphitized carbon fibers. Preferably, the graphitized carbon fibers have a diameter of 5-20 &mgr;m, an average particle size of 10-500 &mgr;m, and a density of 2.20-2.26 g/cm3. The composition may be molded to form a thermally conductive molded article such as a thermally conductive sheet. The thermally conductive polymer composition and thermally conductive molded article have high thermal conductivity and transfer large amounts of heat from electric or electronic parts.
    Type: Application
    Filed: August 31, 2001
    Publication date: May 16, 2002
    Inventors: Masayuki Tobita, Natsuko Ishihara, Naoyuki Shimoyama, Shinya Tateda
  • Publication number: 20020050585
    Abstract: A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.
    Type: Application
    Filed: August 2, 2001
    Publication date: May 2, 2002
    Inventors: Tobita Masayuki, Shinya Tateda, Tsuneh isa Kimura, Masahumi Yamato
  • Publication number: 20010004131
    Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 21, 2001
    Inventors: Tobita Masayuki, Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato
  • Publication number: 20010004546
    Abstract: A heat conductive mold is provided in which boron nitride powder has a magnetic field which is oriented in a fixed direction within a polymer. The polymer is preferably at least one selected from silicon rubber, epoxy, Polyimide and polyurethane. The content of the boron nitride powder is from twenty-two 400 weight parts to 100 weight parts ofpolymer. A method is also provided in which a heat conductive mold of excellent heat conductivity is provided. The method includes impressing a magnetic field to the polymer composition containing boron nitride powder. The magnetic field impressed on the boron nitride powder, in the composition is impressed to have a fixed direction. The field is set after the direction is established. As an alternative, the method may include pressing the magnetic field to the polymer composition including the boron nitride powder and also a solvent.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 21, 2001
    Inventors: Masayuki Tobita, Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato