Patents by Inventor Shinya TOMIDA

Shinya TOMIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipation
    Patent number: 10943854
    Abstract: A semiconductor package includes a metal board, a first frame, and a second frame. The metal board has an upper surface with a mount area on which a semiconductor device is mountable. The first frame is located on the upper surface of the metal board to surround the mount area. The second frame is located on a bottom surface of the metal board to overlap the first frame. The metal board includes a protrusion protruding from its bottom surface. The protrusion has side surfaces in contact with inner walls of the second frame. The protrusion has a bottom surface located below the second frame.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: March 9, 2021
    Assignee: KYOCERA Corporation
    Inventors: Michikazu Nagata, Shoujirou Kizu, Shinya Tomida
  • HEAT DISSIPATION BOARD AND ELECTRONIC APPARATUS
    Publication number: 20210066159
    Abstract: A heat dissipation board includes a substrate, first, second, and third portions, and a bond. The substrate has a through-hole and includes a metal material. The first portion is located in the through-hole. The first portion has a higher thermal conductivity than the substrate and includes a metal material. The second portion is located on an upper surface of the substrate. The second portion has a higher thermal conductivity than the substrate and includes a metal material. The third portion is located on a lower surface of the substrate. The third portion has a higher thermal conductivity than the substrate and includes a metal material. The bond is between the substrate and the second portion, and between the substrate and the third portion. The first portion is at least partially continuous with the second portion and with the third portion through the bond or the bonding layer.
    Type: Application
    Filed: April 23, 2019
    Publication date: March 4, 2021
    Applicant: KYOCERA Corporation
    Inventors: Shinya TOMIDA, Hisaki MASUDA, Toshiharu KOMORI, Norimasa UEDA
  • SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
    Publication number: 20190279923
    Abstract: A semiconductor package includes a metal board, a first frame, and a second frame. The metal board has an upper surface with a mount area on which a semiconductor device is mountable. The first frame is located on the upper surface of the metal board to surround the mount area. The second frame is located on a bottom surface of the metal board to overlap the first frame. The metal board includes a protrusion protruding from its bottom surface. The protrusion has side surfaces in contact with inner walls of the second frame. The protrusion has a bottom surface located below the second frame.
    Type: Application
    Filed: October 12, 2017
    Publication date: September 12, 2019
    Applicant: KYOCERA Corporation
    Inventors: Michikazu NAGATA, Shoujirou KIZU, Shinya TOMIDA