Patents by Inventor Shinya YABUNO
Shinya YABUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11124649Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.Type: GrantFiled: July 10, 2017Date of Patent: September 21, 2021Assignee: NICHIA CORPORATIONInventors: Shinya Yabuno, Ryo Itaya, Yasunobu Nakagawa
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Publication number: 20210277236Abstract: The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.5, and 0.8?m+n?3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.Type: ApplicationFiled: July 10, 2017Publication date: September 9, 2021Applicant: NICHIA CORPORATIONInventors: Shinya YABUNO, Ryo ITAYA, Yasunobu NAKAGAWA
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Patent number: 10947384Abstract: An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %.Type: GrantFiled: August 24, 2017Date of Patent: March 16, 2021Assignee: DAICEL CORPORATIONInventors: Yasunobu Nakagawa, Shinya Yabuno
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Patent number: 10870758Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.Type: GrantFiled: February 20, 2017Date of Patent: December 22, 2020Assignee: DAICEL CORPORATIONInventors: Shinya Yabuno, Ryo Itaya, Shigeaki Kamuro, Yasunobu Nakagawa
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Patent number: 10619046Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4, wherein each R1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by an average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.Type: GrantFiled: March 23, 2017Date of Patent: April 14, 2020Assignee: DAICEL CORPORATIONInventors: Yasunobu Nakagawa, Shinya Yabuno
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Publication number: 20200048460Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the following average composition formula: R2mHnSiO[(4?m?n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.8?m+n?3; and (C): a hydrosilylation catalyst.Type: ApplicationFiled: February 20, 2017Publication date: February 13, 2020Applicant: DAICEL CORPORATIONInventors: Shinya YABUNO, Ryo ITAYA, Shigeaki KAMURO, Yasunobu NAKAGAWA
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Publication number: 20190218346Abstract: An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3?0, a4>0, 0.01?a1/a2?10, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %.Type: ApplicationFiled: August 24, 2017Publication date: July 18, 2019Applicant: DAICEL CORPORATIONInventors: Yasunobu NAKAGAWA, Shinya YABUNO
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Publication number: 20190106571Abstract: An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4, wherein each R1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R1, and a1>0, a2>0, a3?0, a4>0, 0.5?a1/a2?10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by the following average composition formula (II): R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7?m?2.1, 0.001?n?1.0, and 0.Type: ApplicationFiled: March 23, 2017Publication date: April 11, 2019Applicant: DAICEL CORPORATIONInventors: Yasunobu NAKAGAWA, Shinya YABUNO