Patents by Inventor Shinya Yoneda

Shinya Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210053761
    Abstract: A finger guard member includes: a first surface disposed between one end of a roller and a belt wound around the one end; a second surface in which a notch having a width larger than a shaft diameter of a fixed shaft of the roller is formed with respect to the fixed shaft positioned outside the one end in a longitudinal direction of the roller; and a positioning part disposed inside the notch. When the fixed shaft has a first shaft diameter, the finger guard member is positioned by the positioning part being supported by a peripheral surface of the fixed shaft. When the fixed shaft has a second shaft diameter greater than the first shaft diameter, the finger guard member is positioned by an edge of the notch being supported by the peripheral surface of the fixed shaft with the positioning part being not present on the second surface.
    Type: Application
    Filed: December 27, 2018
    Publication date: February 25, 2021
    Applicant: KYOWA MANUFACTURING CO., LTD.
    Inventors: Georg Helmut MALINA, Takashi FURUI, Ryo YONEDA, Shinya YAMAMOTO
  • Patent number: 10926955
    Abstract: A finger guard member includes: a first surface disposed between one end of a roller and a belt wound around the one end; a second surface in which a notch having a width larger than a shaft diameter of a fixed shaft of the roller is formed with respect to the fixed shaft positioned outside the one end in a longitudinal direction of the roller; and a positioning part disposed inside the notch. When the fixed shaft has a first shaft diameter, the finger guard member is positioned by the positioning part being supported by a peripheral surface of the fixed shaft. When the fixed shaft has a second shaft diameter greater than the first shaft diameter, the finger guard member is positioned by an edge of the notch being supported by the peripheral surface of the fixed shaft with the positioning part being not present on the second surface.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: February 23, 2021
    Assignee: KYOWA MANUFACTURING CO., LTD.
    Inventors: Georg Helmut Malina, Takashi Furui, Ryo Yoneda, Shinya Yamamoto
  • Patent number: 10921069
    Abstract: A stacking-type header includes a first plate having a first through-hole; a second plate having a plurality of second through-holes; a third plate in which a flow path that communicates between the first through-hole and the second through-holes is formed, a first pipe including a first end portion that is inserted into the first through-hole; a plurality of second pipes each including a second end portion that is inserted into a corresponding one of the second through-holes; and brazing portions. The first pipe includes a first expanded portion in the first end portion, the first expanded portion having an outer peripheral surface that is pressed against an inner peripheral surface of the first through-hole. Each of the second pipes includes a second expanded portion having an outer peripheral surface that is pressed against an inner peripheral surface of a corresponding one of the second through-holes.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: February 16, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takehiro Hayashi, Tomoyuki Hayashi, Norihiro Yoneda, Kenichi Kitani, Shinya Higashiiue
  • Publication number: 20200328317
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer 11 has a density of 0.880 g/cm3 to 0.930 g/cm3 and a melting point of 70° C. or higher, a skin layer 12 has a density of 0.880 g/cm3 to 0.900 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 12 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer 12 in the whole resin component is 300 ppm to 2000 ppm.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 15, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Publication number: 20200328316
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 15, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Patent number: 10720752
    Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: July 21, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Akinori Yoneda, Shinya Sonobe, Hiroaki Yuto
  • Patent number: 10459131
    Abstract: A retroreflective sheeting, comprising a surface protective layer; the surface protective layer comprises at least one acrylic polymer; the glass-transition temperature (Tg) of the product generated from the reaction of the acrylic polymer is 10° C.-35° C. and the coagulation ratio is 0%-95%; such retroreflective sheeting has favorable weatherability, low-temperature embossing resistance and adhesion resistance; it also discloses a vehicle license plate adopting the retroreflective sheeting.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: October 29, 2019
    Assignee: NIPPON CARBIDE INDUSTRIES (HANGZHOU) CO., LTD.
    Inventors: Hiroki Nakazawa, Shinya Kanamori, Yosuke Meta, Daisuke Yoneda
  • Patent number: 10378833
    Abstract: A stacking-type header according to the present invention includes a plurality of first plates and a plurality of second plates stacked on one another and brazed together such that each of the plurality of second plates is disposed between adjoining two of the plurality of first plates. The plurality of first plates include a first end plate that is an outermost one of the plurality of first plates in a stacking direction of the plurality of first plates and that has a first through hole, and a second end plate that is another outermost one of the plurality of first plates in the stacking direction of the plurality of first plates and that has a plurality of second through holes. The plurality of first plates and the plurality of second plates have a communication hole that connects the first through hole of the first end plate and the plurality of second through holes of the second end plate. The plurality of second plates each have at least one opening formed at other than the communication hole.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: August 13, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinya Higashiiue, Shigeyoshi Matsui, Takehiro Hayashi, Norihiro Yoneda, Atsushi Mochizuki
  • Publication number: 20190154365
    Abstract: A stacking-type header includes a first plate having a first through-hole; a second plate having a plurality of second through-holes; a third plate in which a flow path that communicates between the first through-hole and the second through-holes is formed, a first pipe including a first end portion that is inserted into the first through-hole; a plurality of second pipes each including a second end portion that is inserted into a corresponding one of the second through-holes; and brazing portions. The first pipe includes a first expanded portion in the first end portion, the first expanded portion having an outer peripheral surface that is pressed against an inner peripheral surface of the first through-hole. Each of the second pipes includes a second expanded portion having an outer peripheral surface that is pressed against an inner peripheral surface of a corresponding one of the second through-holes.
    Type: Application
    Filed: August 8, 2016
    Publication date: May 23, 2019
    Inventors: Takehiro HAYASHI, Tomoyuki HAYASHI, Norihiro YONEDA, Kenichi KITANI, Shinya HIGASHIIUE
  • Publication number: 20170013711
    Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
    Type: Application
    Filed: September 26, 2016
    Publication date: January 12, 2017
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mikiko HOJO, Shinya YONEDA, Naonobu YOSHI, Takeshi SATO, Kisei MATSUMOTO
  • Patent number: 9497859
    Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
    Type: Grant
    Filed: September 6, 2010
    Date of Patent: November 15, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mikiko Hojo, Shinya Yoneda, Naonobu Yoshi, Takeshi Sato, Kisei Matsumoto
  • Publication number: 20120267151
    Abstract: Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same. Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.
    Type: Application
    Filed: September 6, 2010
    Publication date: October 25, 2012
    Inventors: Mikiko Hojo, Shinya Yoneda, Naonobu Yoshi, Takeshi Sato, Kisei Matsumoto