Patents by Inventor Shinya Yoneda

Shinya Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230099082
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer has a density of 0.880 g/cm3 to 0.895 g/cm3 and a melting point of 70° C. or higher, a skin layer has a density of 0.880 g/cm3 to 0.910 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 11 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer in the whole resin component is 300 ppm to 2000 ppm.
    Type: Application
    Filed: October 3, 2022
    Publication date: March 30, 2023
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Publication number: 20220352404
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 3, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Patent number: 11393941
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 19, 2022
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke Saeki, Shinya Yoneda, Jun Tanaka, Hiroaki Tamaki, Shinsuke Nagino, Naohiro Obonai
  • Publication number: 20200328316
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity, and can also suppress unevenness in thickness at the time of integration as a solar-cell module. There is provided a sealing material sheet 1 in which there are two inflection point temperatures that are temperatures only around which a change rate of the linear expansion coefficient locally increases, a first inflection point temperature at a low temperature side of two inflection point temperatures is within a range of 55° C. to 70° C., and a second inflection point at a high temperature side of the inflection point temperatures is within a range of 80° C. to 95° C.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 15, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Publication number: 20200328317
    Abstract: To provide a sealing material sheet for a solar-cell module that has high productivity without performing crosslinking processing, and has a high tensile shear adhesion force at normal temperature at a high level in addition to heat resistance and molding characteristics. A sealing material sheet is a multi-layer sheet using a polyethylene-based resin as a base resin, a core layer 11 has a density of 0.880 g/cm3 to 0.930 g/cm3 and a melting point of 70° C. or higher, a skin layer 12 has a density of 0.880 g/cm3 to 0.900 g/cm3 and a melting point of 90° C. or lower and contains a silane-modified polyethylene-based resin, a weight average molecular weight of the silane-modified polyethylene-based resin contained in the skin layer 12 in terms of polystyrene is 70000 to 120000, and a polymerized silane amount of the skin layer 12 in the whole resin component is 300 ppm to 2000 ppm.
    Type: Application
    Filed: April 11, 2019
    Publication date: October 15, 2020
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kosuke SAEKI, Shinya YONEDA, Jun TANAKA, Hiroaki TAMAKI, Shinsuke NAGINO, Naohiro OBONAI
  • Publication number: 20170013711
    Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
    Type: Application
    Filed: September 26, 2016
    Publication date: January 12, 2017
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mikiko HOJO, Shinya YONEDA, Naonobu YOSHI, Takeshi SATO, Kisei MATSUMOTO
  • Patent number: 9497859
    Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.
    Type: Grant
    Filed: September 6, 2010
    Date of Patent: November 15, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Mikiko Hojo, Shinya Yoneda, Naonobu Yoshi, Takeshi Sato, Kisei Matsumoto
  • Publication number: 20120267151
    Abstract: Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same. Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.
    Type: Application
    Filed: September 6, 2010
    Publication date: October 25, 2012
    Inventors: Mikiko Hojo, Shinya Yoneda, Naonobu Yoshi, Takeshi Sato, Kisei Matsumoto