Abstract: A GPS signal transmitter configured with a reduced number of components and achieving low cost, space saving, and low power is provided. A GPS signal transmitter of the present invention includes: a crystal oscillator; a carrier wave generator that outputs a first carrier wave and a second carrier wave whose phase is inverted to the phase of the first carrier wave, using a clock output by the crystal oscillator; a microcomputer that is driven with the clock output by the crystal oscillator and outputs a control signal based on a C/A code which is a pseudo random code; a switch that switches over between the first carrier wave and the second carrier wave according to the control signal from the microcomputer and generates a modulation wave; and an antenna that transmits the modulation wave by radio.

Abstract: There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

Abstract: There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.

Abstract: A GPS signal transmitter configured with a reduced number of components and achieving low cost, space saving, and low power is provided. A GPS signal transmitter of the present invention includes: a crystal oscillator; a carrier wave generator that outputs a first carrier wave and a second carrier wave whose phase is inverted to the phase of the first carrier wave, using a clock output by the crystal oscillator; a microcomputer that is driven with the clock output by the crystal oscillator and outputs a control signal based on a C/A code which is a pseudo random code; a switch that switches over between the first carrier wave and the second carrier wave according to the control signal from the microcomputer and generates a modulation wave; and an antenna that transmits the modulation wave by radio.

Abstract: For cleaning a wafer by a cleaning apparatus, a cleaning liquid is contained in a cleaning bath. Leaving two brushes open, the wafer is inserted to the cleaning bath, placed on oscillation and rotation rollers and retained by the rollers. The brushes are closed and the wafer is held by the brushes. Next, the two brushes are rotated while the wafer is oscillated and rotated by the rollers and so on. Furthermore, ultrasonic vibrations are applied to the cleaning liquid in the cleaning bath by an ultrasonic generator. Scrub cleaning with the two brushes and ultrasonic cleaning by ultrasonic vibrations are thereby performed on the wafer.

Abstract: For cleaning a wafer by a cleaning apparatus, a cleaning liquid is contained in a cleaning bath. Leaving two brushes open, the wafer is inserted to the cleaning bath, placed on oscillation and rotation rollers and retained by the rollers. The brushes are closed and the wafer is held by the brushes. Next, the two brushes are rotated while the wafer is oscillated and rotated by the rollers and so on. Furthermore, ultrasonic vibrations are applied to the cleaning liquid in the cleaning bath by an ultrasonic generator. Scrub cleaning with the two brushes and ultrasonic cleaning by ultrasonic vibrations are thereby performed on the wafer.

Abstract: A cleaning apparatus includes a cleaning tank for reserving cleaning fluid, an object to be cleaned being immersed in the cleaning fluid, a vibrator for vibrating the cleaning fluid in the cleaning tank, and two micro-vibration sources for minutely vibrating the object to be cleaned in two different directions.

Abstract: A cleaning apparatus includes a cleaning tank for reserving cleaning fluid, an object to be cleaned being immersed in the cleaning fluid, a vibrator for vibrating the cleaning fluid in the cleaning tank, and two micro-vibration sources for minutely vibrating the object to be cleaned in two different directions.

Abstract: In the case where an object to be ground is ground by mounting a horizontally elongated jig onto a grinding head and by bringing the object into contact with a grinding surface of a grinding disk being driven and rotated, the attitude of the grinding head is controlled by an adjust ring that is in surface contact with the grinding surface of the grinding disk while moving the grinding head, the horizontally elongated jig holding thereon the object that has a plurality of thin film magnetic heads arrayed thereon. Thereby, the flatness of the object is improved and variations in the throat heights of many magnetic heads formed on the object to be ground are reduced by allowing the attitude of the object to be controlled with a grinding surface of a grinding disk as a reference.