Patents by Inventor Shinzi Takeda

Shinzi Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of manufacturing semiconductor device
    Patent number: 5529634
    Abstract: An evaporation chamber for forming fine metal particles is separated from a film formation chamber in which the substrate having a metal film such as a metal column thereon is placed during metal film deposition. The pressure of the film formation chamber is set to be lower than that of the evaporation chamber, and the fine metal particles are sprayed on the substrate by the pressure difference to form the metal column. Therefore, a wiring layer, a connection electrode for connecting the wiring layer to another wiring layer, and the like can easily be formed by a small number of steps.
    Type: Grant
    Filed: April 19, 1995
    Date of Patent: June 25, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masahiro Miyata, Hidemitsu Egawa, Johta Fukuhara, Shinzi Takeda, Hirokazu Ezawa