Patents by Inventor Shinzi Umemoto

Shinzi Umemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making multilayer printed wiring board
    Patent number: 4372804
    Abstract: The thickness of copper foil at the land formation area of a copper clad laminate of a miniaturized high density circuit is made thicker than the remaining area to assure high reliability of connection between the through hole plating and the land.
    Type: Grant
    Filed: April 2, 1981
    Date of Patent: February 8, 1983
    Assignee: Fujitsu Limited
    Inventors: Takayoshi Hanabusa, Kenji Yamamoto, Shinzi Umemoto, Keiji Kurosawa, Mitsuo Yamashita