Patents by Inventor Shinzo Sugai
Shinzo Sugai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5578898Abstract: A shadow mask with a low thermal expandability of an Fe--Ni-based alloy and a high surface hardness is disclosed. This shadow mask includes a mask main body consisting of an Fe--Ni-based alloy containing iron and nickel as main constituents, a large number of fine electron beam apertures formed in the mask main body, and a surface layer formed on the surface of the mask main body and containing at least one compound selected from the group consisting of iron nitride, iron nickel nitride, iron boride, iron nickel boride, iron silicide, and iron nickel silicide.Type: GrantFiled: January 16, 1996Date of Patent: November 26, 1996Assignee: Kabushiki Kaisha ToshibaInventors: Emiko Higashinakagawa, Mituharu Hagiwara, Shinzo Sugai, Yasuhisa Ohtake, Fumio Mori
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Patent number: 5341025Abstract: An IC package and LSI package having a lead frame of a copper alloy that contains 0.1 to 1% by weight of chromium, 0.01 to 0.5% by weight of zirconium and that has partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less is disclosed. The lead frame is, for example, obtained from an alloy that contains 0,005% by weight of sulfur or less. The lead frame has high reliability, can be produced in high yield and has high electrical conductivity.Type: GrantFiled: March 23, 1993Date of Patent: August 23, 1994Assignee: Kabushiki Kaisha ToshibaInventors: Nobuaki Nakashima, Shinzo Sugai
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Patent number: 5294761Abstract: A vacuum interrupter comprises a vacuum container which includes an insulation tube made of ceramics and having openings at both ends thereof, and sealing metals for hermetically sealing the openings respectively. In the vacuum container, a pair of contacts are disposed so that these contacts can detachably contact to each other. The composition of the material constituting at least one of the sealing metals comprises 25 to 55 wt % of Ni, 0.02 to 1.0 wt % of Si and substantially the residual amount of Cu. Preferably, the composition further comprises 0.02 to 1.5 wt % in total of Si and Mn and/or 5.0 wt % or less in total of Fe and Co.Type: GrantFiled: November 20, 1992Date of Patent: March 15, 1994Assignee: Kabushiki Kaisha ToshibaInventors: Tsutomu Okutomi, Tsuneyo Seki, Hideo Suzuki, Shinzo Sugai, Kazuya Tujimoto, Hiroshi Watanabe, Kiyoshi Osabe, Atsushi Yamamoto, Hiroshi Yamazoe
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Patent number: 5264050Abstract: A Fe-Ni based alloy consists essentially of Ni of 25% by weight to 55% by weight, C of 0.001% by weight to 0.1% by weight, at least one element selected from Group IVb elements and Group Vb elements, e.g., Nb, or Ta of 0.01% by weight to 6% weight, and the balance being Fe and unavoidable impurities. The Fe-Ni based alloy contains dispersed particles inclusive of a carbide in the substructure. The carbide is a carbide of the Group IVb element or the Group Vb element. Since the dispersed particle inclusive of the carbide are finely and uniformly present in the substructure, mechanical strength, heat resistance and, a performance of punching work are improved. Additionally, a quantity of gas release in a vacuum can be reduced.Type: GrantFiled: January 6, 1992Date of Patent: November 23, 1993Assignee: Kabushiki Kaisha ToshibaInventors: Nobuaki Nakashima, Shinzo Sugai, Eiichi Watanabe
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Patent number: 5210441Abstract: A lead frame comprising a copper alloy containing 0.1 to 1 % by weight of chromium, 0.01 to 0.5% by weight of zirconium and having partial discolored regions caused by unbalanced precipitation of the zirconium distributed thereon at a rate of 2 grains/100 cm.sup.2 or less. The lead frame is, for example, obtained by an alloy containing 0.005% by weight of sulphur or less. The lead frame has an high reliability, high yield of production and high electrical conductivity.Type: GrantFiled: December 20, 1991Date of Patent: May 11, 1993Assignee: Kabushiki Kaisha ToshibaInventors: Nobuaki Nakashima, Shinzo Sugai
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Patent number: 5098652Abstract: The present invention provides non-magnetic stainless steel which is used as materials for small parts in precision machines and electronic equipment. The non-magnetic stainless steel consists of an iron-based alloy containing 9 to 22% by weight of nickel, 12 to 26% by weight of chromiun, the balance of iron and inevitable impurities. The martensitic area ratio of the iron-based alloy structure is not more than 20%. The stainless steel exhibits excellent workability and is suitable as a raw material for TV electron gun parts and small gears which are formed by strong working such as blanking or the like.Type: GrantFiled: June 11, 1990Date of Patent: March 24, 1992Assignee: Kabushiki Kaisha ToshibaInventors: Tsuyoshi Yasui, Nobuaki Nakashima, Shinzo Sugai, Eiichi Watanabe
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Patent number: 4864188Abstract: Disclosed is an Invar alloy original sheet for use in the production of a shadow mask, wherein the Invar alloy original sheet has the cleanliness measured by the method regulated in JIS G 0555, of 0.07% or less.Disclosed is also a shadow mask comprising an Invar alloy original sheet having the cleanliness mentioned above.By use of the Invar alloy original sheet of this invention, the problem of non-uniformity and irregurarity of inner wall surface of perforations formed on the original sheet for shadow mask is decreased to a great extent.Type: GrantFiled: November 30, 1987Date of Patent: September 5, 1989Assignee: Kabushiki Kaisha ToshibaInventors: Shinzo Sugai, Fumio Mori
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Patent number: 4835548Abstract: In a thermal head, an electrical and heat insulating layer of glass is formed on a substrate made of ferrie Fe-Cr stainless steel. Fe-Cr stainless steel contains 16 to 18% chromium by weight. Heating resistors having a specific patterns are formed on the electrical and heat insulating layer and electrically connected to the substrate acting as a common electrode. Lead wires of an A.lambda.-Si-Cu alloy, as individual electrodes, are formed on the layer and the heating resistors. The heating resistors and the lead wires are covered by a protective layer.Type: GrantFiled: June 17, 1987Date of Patent: May 30, 1989Assignee: Kabushiki Kaisha ToshibaInventors: Masaru Nikadio, Yoshiaki Ouchi, Tadayoshi Kinoshita, Reiko Watanabe, Shinzo Sugai
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Patent number: 4771213Abstract: A cast ingot of an invar alloy is forged, hot-and cold-rolled, annealed and subjected to a controlled rolling to provide a shadow mask plate. An X-ray diffraction pattern is formed in an electron-beam hole-formation surface of the shadow mask plate, and a draft in a controlled rolling step is so controlled that the "g" value is 2 or more. The "g" value is given asg=(I.sub.1 +I.sub.2)/I.sub.3whereI.sub.1 =the X-ray diffraction integrated intensity at the {200} crystal faces;I.sub.2 =the X-ray diffraction integrated intensity at the {111} crystal faces; andI.sub.3 =the X-ray diffraction integrated intensity at the {220} crystal faces.The shadow mask plate is etched to provide shadow masks each having electron-beam holes formed therein, noting that one hole surface side which has greater {100} texture is used as a larger-diameter hole surface side.Type: GrantFiled: October 27, 1986Date of Patent: September 13, 1988Assignee: Kabushiki Kaisha ToshibaInventors: Emiko Higashinakagawa, Michihiko Inaba, Yasuhisa Ohtake, Masaharu Kanto, Shinzo Sugai
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Patent number: 4640723Abstract: A lead frame consists of a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium and having a precipitate with a grain size of 0.5 to 50 .mu.m distributed therein at a rate of 1,000 to 10,000 grains/mm.sup.2. The lead frame is manufactured by casting a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium by continuous casting, and performing rolling, a solution treatment, a cold working, and an age-hardening. The lead frame has an excellent bonding performance with an Au wire, hardness and bending strength, and is inexpensive.Type: GrantFiled: December 20, 1983Date of Patent: February 3, 1987Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Shinzo Sugai, Shigemi Yamane, Takashi Kuze
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Patent number: 4290828Abstract: A bimetal is disclosed having a high, rapid deflection over a specified temperature range, including a high expansion metal alloy component having a high thermal expansion coefficient that changes rapidy at 50.times.10.sup.-6 /.degree.C. or greater at a temperature of between about 100.degree. C. and 250.degree. C. and containing from 15-30% by weight of manganeses, the balance of iron. The second component has a substantially constant thermal expansion coefficient regardless of the temperature change, and is preferably a stainless steel. These bimetals are used in circuit breakers, thermal protectors and the like.Type: GrantFiled: July 11, 1979Date of Patent: September 22, 1981Assignee: Tokyo Shibaura Electric Co., Ltd.Inventors: Tatsuyoshi Aisaka, Mitsuo Kawai, Fumio Mori, Shinzo Sugai
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Patent number: 4207381Abstract: A bimetal is disclosed having a high, rapid deflection over a specified temperature range, including a high expansion metal alloy component having a high thermal expansion coefficient that changes rapidly at 50.times.10.sup.-6 /.degree. C. or greater at a temperature of between about 100.degree. C. and 250.degree. C. and containing from 15-30% by weight of manganese, the balance of iron. The second component has a substantially constant thermal expansion coefficient regardless of the temperature change, and is preferably a stainless steel. These bimetals are used in circuit breakers, thermal protectors and the like.Type: GrantFiled: February 22, 1978Date of Patent: June 10, 1980Assignee: Tokyo Shibaura Electric Co., Ltd.Inventors: Tatsuyoshi Aisaka, Mitsuo Kawai, Fumio Mori, Shinzo Sugai