Patents by Inventor Shioko Saya

Shioko Saya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7141647
    Abstract: A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: November 28, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shioko Saya, Taro Fukaya, Cao Minh Thai, Shinetsu Fujieda
  • Patent number: 7138435
    Abstract: A method of decomposing a thermosetting resin by a decomposer comprising the steps of: pre-heating the thermosetting resin up to a pre-heating temperature T0; kneading the pre-heated thermosetting resin together with a decomposer, and concurrently heating a mixture comprising the thermosetting resin and the decomposer up to a kneading temperature T1, thereby allowing a reaction to take place between the decomposer and the thermosetting resin to obtain a kneaded matter wherein the decomposer becomes consumed; and heating the kneaded matter to a maximum temperature T2 to thereby decompose the thermosetting resin; wherein the preheating temperature T0 is not higher than the boiling temperature of the decomposer; the kneading temperature T1 is not lower than the pre-heating temperature T0 but is lower than the thermal decomposition temperature of the thermosetting resin; the maximum temperature T2 is lower than the decomposition temperature of the thermosetting resin; and the pre-heating of the thermosetting resi
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: November 21, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yumiko Oyasato, Cao Minh Thai, Shioko Saya, Shinetsu Fujieda, Tomiaki Furuya
  • Publication number: 20050020701
    Abstract: A method of treating waste product containing flexible polyurethane resin includes adding a decomposing agent to the waste product to start a decomposition reaction; and terminating the decomposition reaction at a stage in which a diamine concentration derived from an isocyanate raw material of the flexible polyurethane resin is 2 wt % or lower to obtain a pasty intermediate product.
    Type: Application
    Filed: June 23, 2004
    Publication date: January 27, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shioko Saya, Taro Fukaya, Cao Thai, Shinetsu Fujieda
  • Publication number: 20050010025
    Abstract: The invention relates to a resin composition that has, as a raw material, a product that is obtained by addition reacting a compound having a unsaturated carbon bond to a resin decomposed product obtained by chemically decomposing a urethane resin, alternatively, by decomposing a urethane resin with a compound having a unsaturated carbon bond. The resin composition can be solidified by polymerization by use of a cross-linking agent and an addition polymerization initiator. Furthermore, when a compound having two or more carboxyl groups or an anhydride thereof is blended together with the urethane resin decomposition, a resin composition can be obtained. When the resin composition obtained thereby is cured, a recycled resin with excellent properties can be obtained.
    Type: Application
    Filed: June 21, 2004
    Publication date: January 13, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Taro Fukaya, Cao Thai, Shioko Saya, Shinetsu Fujieda
  • Publication number: 20040143085
    Abstract: A novel method for decomposing urethane resin suppresses the generation of aromatic amines and facilitates the recycling of urethane resins. To decompose urethane resin, the method involves the use of a decomposing agent that has both an ability to cleave urethane bonds in a urethane resin and an ability to react with and thus capture an amine compound. The decomposing agent is preferably one that contains either at least one selected from carboxyl group, and a salt, ester and acid anhydride thereof, or at least one selected from isocyanate group and epoxy group.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 22, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Taro Fukaya, Cao Minh Thai, Shioko Saya, Shinetsu Fujieda
  • Publication number: 20030229152
    Abstract: Disclosed is a method of adding a compound having at least one group selected from the group consisting of a carboxyl group, salts thereof, esters thereof and haloformyl groups or an acid anhydride, as a treating agent, to a resin decomposed substance prepared by decomposing a urethane bond of a urethane resin, and adding an epoxy resin or isocyanate compound to the product, to regenerate the resin. According to the present invention, reaction activity in producing a regenerated resin from a urethane resin decomposed substance is appropriately suppressed, and thus regeneration of a urethane resin can be carried out by easy procedures.
    Type: Application
    Filed: May 27, 2003
    Publication date: December 11, 2003
    Applicant: KABUSHIKI KAISHA TOSHIBA, Tokyo, JAPAN
    Inventors: Taro Fukaya, Cao Minh Thai, Shioko Saya
  • Publication number: 20020170474
    Abstract: A method of decomposing a thermosetting resin by a decomposer comprising the steps of: pre-heating the thermosetting resin up to a pre-heating temperature T0; kneading the pre-heated thermosetting resin together with a decomposer, and concurrently heating a mixture comprising the thermosetting resin and the decomposer up to a kneading temperature T1, thereby allowing a reaction to take place between the decomposer and the thermosetting resin to obtain a kneaded matter wherein the decomposer becomes consumed; and heating the kneaded matter to a maximum temperature T2 to thereby decompose the thermosetting resin; wherein the preheating temperature T0 is not higher than the boiling temperature of the decomposer; the kneading temperature T1 is not lower than the pre-heating temperature T0 but is lower than the thermal decomposition temperature of the thermosetting resin; the maximum temperature T2 is lower than the decomposition temperature of the thermosetting resin; and the pre-heating of the thermosetting resi
    Type: Application
    Filed: September 28, 2001
    Publication date: November 21, 2002
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yumiko Oyasato, Cao Minhthai, Shioko Saya, Shinetsu Fujieda, Tomiaki Furuya