Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.

Abstract: An off-axis light-emitting device and an image capturing module using the same are provided. The off-axis light-emitting device includes a substrate, a light-emitting chip, and an optical element. The substrate has a mounting surface, and the light-emitting chip for generating a light beam has a light output surface. The light-emitting chip is disposed on the assembly surface. The optical element is disposed on the assembly surface and includes a dome portion. The dome portion is arranged in an optical path of the light beam and extends in a first direction to form an elongated shape. The dome portion has a first reference plane that passes through two opposite side surfaces of the dome portion, and the first reference plane is offset from a geometric center of the light-emitting chip in a second direction, so that the light beam passing through the dome portion forms an off-axis projection light.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

Abstract: The present invention provides a light-emitting module, which comprises a light-emitting device, a light-guiding member, and an external light-guiding member. The light-emitting device emits light. The light-guiding member is disposed on the light-emitting path of the light-emitting module; the external light-guiding member is disposed on the light-emitting path of the light-emitting member. The light-guiding member distributes the light over the light-incidence surface of the external light-guiding member uniformly. After the external light-guiding member, the light is modified to axially symmetric light. Besides, the light-emitting device is disposed in a reflection ring, and a diffuser is disposed on the light-emitting path of the light-emitting device. When a minority of the light-emitting device fail, although the overall energy of the light source is reduced, the influence on the light emission of the light-emitting module is not significant.

Abstract: An ellipsometer for determining thickness and ellipsometric parameters (? and ?) of a thin film material. The apparatus includes a light source emitting light, a transmitting optical system that has a polarizer, modulator and an optical compensator for conveying polarized modulated light for incidence on a film, and a receiving optical system that has an analyzer and conveys the reflected light to a photodetector device. The apparatus is used for full range measurement of ellipsometric parameters by applying two-phase detection method. It also determines thickness of thin films with a high degree of accuracy.