Abstract: The present invention provides an inspection apparatus for osseointegration of implants, which comprises an inspection base, a holding end, and an inspection end. The holding end is disposed at one end of the inspection base; the inspection end is disposed at the other end of the inspection base. Beside, the inspection end is disposed on one side of the holding end. The holding end includes a signal processing module and a wireless transmission module therein. The inspection end includes an inspection probe, disposed at one end of the inspection end. The inspection probe includes one or more excitation device and a receiver located on the same side of the inspection probe. According to the present invention, the inspection apparatus detects the condition of an object under inspection in a non-contact manner by using an excitation source. An acquired displacement difference is then transmitted to an electronic apparatus through wireless transmission.

Abstract: The present invention provides an inspection apparatus for osseointegration of implants, which comprises an inspection base, a holding end, and an inspection end. The holding end is disposed at one end of the inspection base; the inspection end is disposed at the other end of the inspection base. Beside, the inspection end is disposed on one side of the holding end. The holding end includes a signal processing module and a wireless transmission module therein. The inspection end includes an inspection probe, disposed at one end of the inspection end. The inspection probe includes one or more excitation device and a receiver located on the same side of the inspection probe. According to the present invention, the inspection apparatus detects the condition of an object under inspection in a non-contact manner by using an excitation source. An acquired displacement difference is then transmitted to an electronic apparatus through wireless transmission.