Abstract: This invention relates to novel polymers, i.e., poly(5-imidazolones) and a process for preparing same from the reaction of a diazlactone with a primary diamine and thereafter dehydrating the resultant polyamide product. The polymers have good thermal properties and can be used as a composite matrix with a refinforcing agent such as fiber glass.

Abstract: A one component, solventless, storage stable, low temperature, curable urethane composition comprising(1) a branched, blocked isocyanate prepolymer comprising the reaction product of a polyol having a functionality of at least 2, an aromatic polyisocyanate having a functionality of at least 2, the combined functionality of the polyol and the polyisocyanate being greater than 4 and a ketoxime blocker;(2) a polyol crosslinking agent containing at least two OH groups;(3) a deblocking and curing catalyst for (1); and(4) a dessicant.The composition on heating to 100.degree.-120.degree. C. results in a cured polyurethane within 10-30 minutes. The composition can also be combined with polymeric powder, e.g., polymethylmethacrylate to yield cured reactive plastisols. The aforesaid compositions are useful as sealants, coatings or adhesives.

Abstract: This invention relates to novel polymers, i.e., poly(5-imidazolones) and a process for preparing same from the reaction of a diazlactone with a primary diamine and thereafter dehydrating the resultant polyamide product. The polymers have good thermal properties and can be used as a composite matrix with a reinforcing agent such as fiber glass.

Abstract: This invention relates to the use of compositions of the formula: ##STR1## wherein n is 2 to 4 and X is --O--, --S-- or ##STR2## wherein R.sub.1 is an aliphatic or aromatic moiety as a curing agent for epoxy resins to form a thermoset material which has a reduced shrinkage.

Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) poly(phenylene oxide) (PPO) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer containing at least one ethylenically unsaturated group and (c) a mixture of (a) and (b); said liquid reactive plasticizer being capable of solvating the PPO at the fluxing temperature and being present in an amount ranging from 5 to 2,000 parts per 100 parts by weight of (1); and(3) 0.01 to 10% by weight of (2) of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset after the crosslinking reaction.

Abstract: This invention is directed to a process and a novel composition for forming a conductive thermoset material which comprises admixing(a) particles of a polymeric material swellable at its plasticization temperature,(b) at least one liquid reactive plasticizer for (a)(c) optionally and preferably a curing agent for the reactive plasticizer, and(d) heat or electrically conductive particles,and thereafter heating the admixture for a time sufficient to flux and cure same to obtain a conductive thermoset material. Upon heating, above the plasticization temperature, the liquid reactive plasticizer plasticizes the polymer particles. This results in the swelling of the polymer particle, forcing the conductive filler to pack tightly and orderly, thereby increasing the conductivity of the plasticized conductive thermoset after curing.

Abstract: This invention is directed to a process and a novel composition for forming a conductive thermoset material which comprises admixing(a) particles of a polymeric material crosslinked to at least its gel point and swellable at its plasticization temperature,(b) at least one liquid reactive plasticizer for (a)(c) optionally and preferably a curing agent for the reactive plasticizer, and(d) heat or electrically conductive particles, and thereafter heating the admixture for a time sufficient to flux and cure same to obtain a conductive thermoset material. The crosslinking of the thermoplastic polymer can optionally be carried out in a solvent for the polymer. Upon heating, above the plasticization temperature, the liquid reactive plasticizer plasticizes the lightly crosslinked polymer particles. This results in the swelling of the polymer particle, forcing the conductive filler to pack tightly and orderly, thereby increasing the conductivity of the plasticized conductive thermoset after curing.

Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) at least one copolymer of acrylonitrile-butadiene-styrene (ABS) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS at the fluxing temperature, and (c) a mixture of (a) and (b); and(3) an effective amount of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset sealant, coating or adhesive after the crosslinking reaction.

Abstract: This invention relates to a reactive plastisol dispersion comprising(1) a polyvinyl acetal thermoplast in particle form;(2) a liquid plasticizer member of the group consisting of(a) at least one an ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is 1 or more,(b) at least one unsaturated polyester containing the group: ##STR2## wherein R.sub.2 and R.sub.3 are organic moieties, x is 0-20 and y is 1-20; and(c) a mixture of (a) and (b);and, optionally, either(3) a free radical thermal initiator or(4) a photoinitiator for crosslinking.The reactive plastisol dispersion when fluxed can be useful as a sealant or adhesive.

Abstract: This invention relates to a reactive plastisol dispersion comprising(1) a polyvinyl acetal thermoplast in particle form;(2) a liquid plasticizer member of the group consisting of(a) at least one an ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is 1 or more,(b) at least one unsaturated polyester containing the group: ##STR2## wherein R.sub.2 and R.sub.3 are organic moieties, x is 0-20 and y is 1-20; and(c) a mixture of (a) and (b);and, optionally, either(3) a free radical thermal initiator or(4) a photoinitiator for crosslinking.The reactive plastisol dispersion when fluxed can be useful as a sealant or adhesive.

Abstract: This invention is directed to latent thermal curing agents for epoxy resins comprising cyanourea compounds of the formula: ##STR1## wherein R is the organic moiety of a mono- or poly-isocyanate remaining after reaction of the isocyanate group or groups to form cyanourea groups and n is 1 or more, preferably 1 to 2. The epoxy-curing agent system is stable at room temperature and cures at temperatures above 100.degree. C. to form a crosslinked, solid material suitable as an adhesive, sealant or coating. The polymeric form polymerized from dicyanourea compound can be dissolved in a solvent and admixed with an epoxy resin to form a thermoset adhesive, sealant or coating on heating above 100.degree. C. The polymeric form from the combination of cyanourea and dicyanourea or dicyanourea per se dissolving in epoxy resin also forms a thermosetting adhesive, sealant or coating on heating above 100.degree. C.