Patents by Inventor Shipeng Qiu

Shipeng Qiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit and method that utilize a shape memory material
    Patent number: 9635764
    Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 25, 2017
    Assignee: Intel Corporation
    Inventors: Shipeng Qiu, Shawna Liff, Kayleen L Helms, Joshua D Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
  • INTEGRATED CIRCUIT AND METHOD THAT UTILIZE A SHAPE MEMORY MATERIAL
    Publication number: 20170094799
    Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: Shipeng Qiu, Shawna Liff, Kayleen L. Helms, Joshua D. Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
  • Die or substrate marking using a laser
    Patent number: 9472505
    Abstract: Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: October 18, 2016
    Assignee: Intel Corporation
    Inventors: Frank Evans, Shipeng Qiu, Dhruv Bhate, Sergei Voronov, Tao Wang
  • DIE OR SUBSTRATE MARKING USING A LASER
    Publication number: 20150171017
    Abstract: Apparatus, systems, and methods are provided to generate markings on the surface of a die or substrate. The markings represent information. The markings can be annealed onto the surface of the die or substrate using a laser. Another embodiment can use an out-of-focus laser beam to mark a solder resist material.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 18, 2015
    Inventors: Frank Evans, Shipeng Qiu, Dhruv Bhate, Sergei Voronov, Tao Wang