Abstract: A method for preparing a new crystalline form of ?-aminobutyric acid, including the steps of: S1: preparing a ?-aminobutyric acid solution at an initial concentration of 0.5-1.0 g/mL by adding crude ?-aminobutyric acid to water; adding an additive to the ?-aminobutyric acid solution, raising the temperature to 50-80° C., stirring to produce a clear solution; and S2: obtaining a suspension by evaporating water from the product of S1 under reduced pressure and at 50-80° C.; obtaining a wet product by filtering the suspension; drying the wet product to obtain the new crystalline form of ?-aminobutyric acid. The preparation method of the new crystalline form of ?-aminobutyric acid is simple, easy to operate, low in energy consumption, economical and environmentally friendly. It is suitable for large-scale industrial production.

Abstract: A method for preparing a new crystalline form of ?-aminobutyric acid, including the steps of: S1: preparing a ?-aminobutyric acid solution at an initial concentration of 0.5-1.0 g/mL by adding crude ?-aminobutyric acid to water; adding an additive to the ?-aminobutyric acid solution, raising the temperature to 50-80° C., stirring to produce a clear solution; and S2: obtaining a suspension by evaporating water from the product of S1 under reduced pressure and at 50-80° C.; obtaining a wet product by filtering the suspension; drying the wet product to obtain the new crystalline form of ?-aminobutyric acid. The preparation method of the new crystalline form of ?-aminobutyric acid is simple, easy to operate, low in energy consumption, economical and environmentally friendly. It is suitable for large-scale industrial production.

Abstract: An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.

Abstract: A method of using touch screen device for system encryption and protection includes sending plaintext to a touch screen controller by a host; and receiving and encrypting the plaintext to generate ciphertext by the touch screen controller, and returning the ciphertext to the host, thus realizing encryption inside the touch screen device (the plaintext and the ciphertext are exchanged through communication interfaces of the host and the touch screen controller). The encrypting method enables important data (such as accounts or passwords) inputted by a user to be encrypted before being inputted into a system host, thereby preventing the important data from being stolen by malicious software when the data is being transmitted in the form of plaintext to an external encrypting device (such as a “dongle”), thus enhancing security of the touch screen device. Further the method facilitates system encryption of most handy devices and mobile devices.

Abstract: An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.