Abstract: A sterilization and deodorization waste container having dual-wave band ultraviolet lamp tube includes an isolation chamber provided on an inner side of a container lid and a dual-wave band ultraviolet lamp tube installed in the isolation chamber. The dual-wave band ultraviolet lamp tube is capable of simultaneously generating a direct ultraviolet light wave and an ozone ultraviolet light wave. The isolation chamber includes a reflector housing having a light transmitting window facing an inner cavity of a container body. The dual-wave band ultraviolet lamp tube is controlled by a control circuit to turn on to generate the ultraviolets into an inner cavity of the container body while the container lid is closed and to turn off to stop generating the ultraviolet while the container lid is opened.

Abstract: A trash can includes a lid assembly including a lid and a retainer rim and a transition arrangement coupled with the lid assembly that enables the lid to be selectively transited between a normal state and a transition state. In the normal state, the lid is operable between an open state and a close state through a foot pedal. When the lid is pivotally lifted up to have an included angle larger than 90 degrees from the retainer rim, the lid is in the transition state that would not fall back toward the retainer rim and the retainer rim is able to be lifted up to rest on said lid for replacing trash bag until the retainer rim is moved back to site on an upper edge of a shell of the trash can.

Abstract: A sterilization and deodorization waste container includes an isolation chamber provided on an inner side of a container lid and a dual-wave band ultraviolet lamp tube installed in the isolation chamber. The dual-wave band ultraviolet lamp tube is capable of simultaneously generating a direct ultraviolet light wave and an ozone ultraviolet light wave. The isolation chamber includes a reflector housing having a light transmitting window facing an inner cavity of a container body. The dual-wave band ultraviolet lamp tube is controlled by a control circuit to turn on to generate the ultraviolets into an inner cavity of the container body while the container lid is closed and to turn off to stop generating the ultraviolet while the container lid is opened.

Abstract: The invention relates to a sterilization and deodorization waste bin, in particular to a sterilization and deodorization waste bin with a dual-band ultraviolet tube, which comprises an isolation cavity formed in an inner side of a lid and a dual-band ultraviolet tube mounted in the isolation cavity and capable of generating ultraviolet light waves for direct sterilization and ultraviolet light waves for ozone sterilization. The isolation cavity comprises a reflector and transparent quartz glass, an open surface of the reflector faces an inner cavity of the bin body, and the transparent quartz glass matches the open surface of the reflector in shape and size and covers an opening of the reflector through a silicone seal ring.

Abstract: A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.

Abstract: A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.

Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.

Abstract: A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.

Abstract: Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. In one aspect, a full sequence electrochemical mechanical planarization technique is provided. In another aspect, a hybrid planarization technique using combination of at least one chemical mechanical polishing process and at least one electrochemical mechanical polishing process is provided. In addition, a multi-step polishing process for polishing a substrate surface using at least two oxidizers in one or more polishing composition is described. The polishing composition may be used in the full sequence or the hybrid planarization technique. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization defects.

Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.

Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.