Patents by Inventor SHIRLEY SIA

SHIRLEY SIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220320058
    Abstract: An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.
    Type: Application
    Filed: March 4, 2022
    Publication date: October 6, 2022
    Inventors: CHEN-HSIU LIN, SHIRLEY SIA