Abstract: An electronic device includes a light-emitting element whose one end is connected to a first voltage source. A control circuit is connected between the other end of the light-emitting element and a host computer and controls the light-emitting element in accordance with a signal from the host computer. A resistance element is connected between a first connecting portion, which is located between the light-emitting element and the control circuit, and a reference potential source.

Abstract: According to one embodiment, a semiconductor storage device includes: a casing, a first board, a second board, a semiconductor memory component, a connector, and a flexible conductive part. The first board is in the casing. The second board is in the casing. The semiconductor memory component is in the casing. The semiconductor memory component is on the first board. The connector is connectable to a host device. The connector is mounted on the second board, the connector protruding from the casing. The flexible conductive part is between the first board and the second board. The flexible conductive part electrically connects the first board and the second board. The flexible conductive part is bendable.

Abstract: According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.

Abstract: According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.

Abstract: According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

Abstract: According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract: According to one embodiment, a USB device includes a USB connector, a casing, and a holding member. The casing is provided with an opening. The holding member includes a holder, a support, and a first extension. The holder holds the USB connector. The support extends from the holder. The first extension has a protrusion, extends from the support, and is bendable. The protrusion is housed in the opening.

Abstract: According to one embodiment, a USB device includes a USB connector, a casing, and a holding member. The casing is provided with an opening. The holding member includes a holder, a support, and a first extension. The holder holds the USB connector. The support extends from the holder. The first extension has a protrusion, extends from the support, and is bendable. The protrusion is housed in the opening.

Abstract: According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

Abstract: A slide structure comprises first and second members, a slider, a guide, and a first elastic part. The second member is movably supported by the first member. The slider is provided in one of the first member and the second member. The guide is provided in the other of the first member and the second member. The guide movably supports the slider among a first holding position, a slide section, and a second holding position. The first holding position is away or offset from a first position in a first direction. The slide section extends between the first position and a second position. The second position is distant from the first position in a second direction intersecting with the first direction. The second holding position is away or offset from the second position in the first direction.

Abstract: According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the first cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

Abstract: According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

Abstract: A slide structure comprises first and second members, a slider, a guide, and a first elastic part. The second member is movably supported by the first member. The slider is provided in one of the first member and the second member. The guide is provided in the other of the first member and the second member. The guide movably supports the slider among a first holding position, a slide section, and a second holding position. The first holding position is away or offset from a first position in a first direction. The slide section extends between the first position and a second position. The second position is distant from the first position in a second direction intersecting with the first direction. The second holding position is away or offset from the second position in the first direction.

Abstract: According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the t cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.

Abstract: A module includes a base substrate, a flexible substrate including a first portion that is disposed on the substrate and a second portion that is bent from an end of the first portion toward the first portion, and a terminal exposed at the second portion of the flexible substrate. Another module includes a substrate, a convex portion disposed on the substrate, a terminal disposed on the substrate, and a first conductive member including a first portion which is disposed on the substrate and the terminal and is connected to the terminal, and a second portion extending from the first portion and along the surface of the convex portion.