Abstract: A semiconductor device encapsulated within a plastic housing facilitates attachment to a circuit board when a dip soldering process is used. Terminal leads from the semiconductor device extend outwardly through the walls of the housing and are arranged to provide a wetting surface for solder when a semiconductor device that is attached to a circuit board is immersed in a molten solder bath. In one embodiment of the invention, the terminal leads extend upwardly from adjacent the side walls of the housing to a location substantially adjacent the top surface of the housing. When the semiconductor device and circuit board are inverted to immerse the semiconductor device into the solder, the terminal lead acts as a wetting surface to allow solder to flow to the location at which the terminal abuts the circuit board. In another embodiment, the terminal leads extend along the side walls of the housing to a location adjacent the end walls of the housing.