Patents by Inventor Shiro TOYODA
Shiro TOYODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958160Abstract: A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.Type: GrantFiled: November 26, 2018Date of Patent: April 16, 2024Assignee: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Koji Kitagawa, Shiro Toyoda
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Patent number: 11389991Abstract: A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers, the wire being fed from one of a pair of wire reels and taken up by another, the method including feeding a workpiece to the row for slicing while allowing the wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously. Prior to slicing, an abrasive-grain abrading step wherein the wire is allowed to travel without slicing the workpiece, allowing the wire to rub against itself within the reels, and dressing its surface for 30 minutes or more. The method can dress a fixed abrasive grain wire at low cost and suppress thickness unevenness of wafers.Type: GrantFiled: March 6, 2018Date of Patent: July 19, 2022Assignee: SHIN-ETSU HANDOTAI CO., LTD.Inventor: Shiro Toyoda
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Publication number: 20210016413Abstract: A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around multiple grooved rollers, the method including feeding a workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof, thereby slicing the workpiece at multiple positions aligned in an axial direction of the workpiece simultaneously. The method includes: supplying a coolant for workpiece slicing onto the wire row when the workpiece is sliced with the fixed abrasive grain wire; and supplying a coolant for workpiece drawing, which differs from and has a higher viscosity than the coolant for workpiece slicing, onto the wire row when the workpiece is drawn out from the wire row after the slicing of the workpiece.Type: ApplicationFiled: November 26, 2018Publication date: January 21, 2021Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Koji KITAGAWA, Shiro TOYODA
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Publication number: 20200016791Abstract: A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers, the wire being fed from one of a pair of wire reels and taken up by another, the method including feeding a workpiece to the row for slicing while allowing the wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously. Prior to slicing, an abrasive-grain abrading step wherein the wire is allowed to travel without slicing the workpiece, allowing the wire to rub against itself within the reels, and dressing its surface for 30 minutes or more. The method can dress a fixed abrasive grain wire at low cost and suppress thickness unevenness of wafers.Type: ApplicationFiled: March 6, 2018Publication date: January 16, 2020Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventor: Shiro TOYODA
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Patent number: 10518380Abstract: A method for slicing a workpiece using a wire saw which includes wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface around a plurality of grooved rollers, the method including feeding a columnar workpiece to wire row for slicing while allowing fixed abrasive grain wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in axial direction at same time. After end of slicing the workpiece, the fixed abrasive grain wire is rewound from position at the end of slicing the workpiece by length of ? or more and ? or less of the fixed abrasive grain wire fed's length from start of slicing when the workpiece and wire row begin to contact with each other to the end of slicing the workpiece, and then the workpiece is drawn out of wire row.Type: GrantFiled: September 15, 2016Date of Patent: December 31, 2019Assignee: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Koji Kitagawa, Shiro Toyoda
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Publication number: 20180281147Abstract: A method for slicing a workpiece using a wire saw which includes wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface around a plurality of grooved rollers, the method including feeding a columnar workpiece to wire row for slicing while allowing fixed abrasive grain wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in axial direction at same time. After end of slicing the workpiece, the fixed abrasive grain wire is rewound from position at the end of slicing the workpiece by length of ? or more and ? or less of the fixed abrasive grain wire fed's length from start of slicing when the workpiece and wire row begin to contact with each other to the end of slicing the workpiece, and then the workpiece is drawn out of wire row.Type: ApplicationFiled: September 15, 2016Publication date: October 4, 2018Applicant: SHIN-ETSU HANDOTAI CO., LTD.Inventors: Koji KITAGAWA, Shiro TOYODA