Patents by Inventor Shiro Usami

Shiro Usami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10658355
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: May 19, 2020
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20200006321
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Inventor: Shiro USAMI
  • Patent number: 10446540
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: October 15, 2019
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20190006349
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: September 5, 2018
    Publication date: January 3, 2019
    Inventor: Shiro USAMI
  • Patent number: 10096593
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: October 9, 2018
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20180108650
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 19, 2018
    Inventor: Shiro USAMI
  • Patent number: 9871033
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: January 16, 2018
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20170213819
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: April 10, 2017
    Publication date: July 27, 2017
    Inventor: Shiro USAMI
  • Patent number: 9653452
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: May 16, 2017
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Patent number: 9479154
    Abstract: A semiconductor integrated circuit includes a power supply switch circuit which uses a PMOS transistor and an NMOS transistor to select a first power supply voltage applied to a first power supply input terminal or a second power supply voltage applied to a second power supply input terminal, and output the selected voltage as a power supply voltage to a third power supply output terminal, a first switch control circuit connected to the gate of the PMOS transistor, and a second switch control circuit connected to the gate of the NMOS transistor.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: October 25, 2016
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Daisuke Matsuoka, Masahiro Gion, Shiro Usami
  • Publication number: 20160284688
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: June 6, 2016
    Publication date: September 29, 2016
    Inventor: Shiro USAMI
  • Patent number: 9385113
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: July 5, 2016
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20160079224
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: November 18, 2015
    Publication date: March 17, 2016
    Inventor: Shiro USAMI
  • Patent number: 9224725
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: December 29, 2015
    Assignee: SOCIONEXT INC.
    Inventor: Shiro Usami
  • Publication number: 20150171858
    Abstract: A semiconductor integrated circuit includes a power supply switch circuit which uses a PMOS transistor and an NMOS transistor to select a first power supply voltage applied to a first power supply input terminal or a second power supply voltage applied to a second power supply input terminal, and output the selected voltage as a power supply voltage to a third power supply output terminal, a first switch control circuit connected to the gate of the PMOS transistor, and a second switch control circuit connected to the gate of the NMOS transistor.
    Type: Application
    Filed: February 26, 2015
    Publication date: June 18, 2015
    Inventors: Daisuke MATSUOKA, Masahiro GION, Shiro USAMI
  • Publication number: 20150171068
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: February 20, 2015
    Publication date: June 18, 2015
    Inventor: Shiro USAMI
  • Patent number: 8994111
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: March 31, 2015
    Assignee: Panasonic Corporation
    Inventor: Shiro Usami
  • Publication number: 20140191368
    Abstract: Diffusion regions having the same conductivity type are arranged on a side of a second wiring and a side of a third wiring, respectively under a first wiring connected to a signal terminal. Diffusion regions are separated in a whole part or one part of a range in a Y direction. That is, under first wiring, diffusion regions are only formed in parts opposed to diffusion regions formed under the second wiring and third wiring connected to a power supply terminal or a ground terminal, and a diffusion region is not formed in a central part in an X direction. Therefore, terminal capacity of the signal terminal can be reduced without causing ESD resistance to be reduced, in an ESD protection circuit with the signal terminal.
    Type: Application
    Filed: March 11, 2014
    Publication date: July 10, 2014
    Applicant: PANASONIC CORPORATION
    Inventor: Shiro USAMI
  • Patent number: 8598631
    Abstract: A semiconductor integrated circuit chip mounted on a substrate by flip chip bonding includes: a plurality of electrode pads; a corner portion of a flat periphery of an inner layer; a first linear region adjoining one side of the corner portion; a second linear region adjoining another side of the corner portion; and a third linear region adjoining a side of the first linear region opposite to the side adjoining the corner portion. A circuit core placeable region is provided in at least part of the corner portion and the first linear region. A plurality of IO cells connected to the electrode pads are arranged in the second and third linear regions. The IO cells in the second linear region are connected to the electrode pads arranged inwardly in n rows×n columns from a corner of the chip above the corner portion.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: December 3, 2013
    Assignee: Panasonic Corporation
    Inventor: Shiro Usami
  • Publication number: 20130240954
    Abstract: A semiconductor integrated circuit chip mounted on a substrate by flip chip bonding includes: a plurality of electrode pads; a corner portion of a flat periphery of an inner layer; a first linear region adjoining one side of the corner portion; a second linear region adjoining another side of the corner portion; and a third linear region adjoining a side of the first linear region opposite to the side adjoining the corner portion. A circuit core placeable region is provided in at least part of the corner portion and the first linear region. A plurality of IO cells connected to the electrode pads are arranged in the second and third linear regions. The IO cells in the second linear region are connected to the electrode pads arranged inwardly in n rows×n columns from a corner of the chip above the corner portion.
    Type: Application
    Filed: May 7, 2013
    Publication date: September 19, 2013
    Applicant: PANASONIC CORPORATION
    Inventor: Shiro USAMI