Patents by Inventor Shirou Akamatsu

Shirou Akamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring structures and method of manufacturing the same
    Patent number: 5753372
    Abstract: The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).
    Type: Grant
    Filed: July 10, 1995
    Date of Patent: May 19, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Sotokawa, Miharu Otani, Fumio Kataoka, Fusaji Shoji, Haruhiko Matsuyama, Eiji Matsuzaki, Shogi Ikeda, Hidetaka Shigi, Tetsuya Yamazaki, Naoki Matsushima, Shirou Akamatsu