Patents by Inventor Shirou Honda

Shirou Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10072377
    Abstract: A fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition is described. The prepreg includes at least constituents [A], [B], and [C] as specified below and reinforcement fiber, wherein 90% or more of constituent [C] exists in the depth range accounting for 20% of the prepreg thickness from the prepreg surface: [A] epoxy resin; [B] epoxy resin curing agent; and [C] polymer particles insoluble in epoxy resin.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: September 11, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuko Shimizu, Nobuyuki Tomioka, Shirou Honda, Maki Nagano, Yuji Echigo, Hiroshi Takezaki, Junko Kawasaki, Hiroshi Taiko
  • Publication number: 20170306117
    Abstract: Provided is an epoxy resin composition with improved heat resistance and resin elongation. Further provided is a fiber-reinforced composite material which uses the epoxy resin composition and thereby excels in compression strength in high-temperature environments and interlaminar toughness. The epoxy resin composition comprises the constituents [A], [B] and [C], 8-40 mass % of [B] is contained in the epoxy resin composition. The number of moles of active hydrogen contained in [C] is 1.05-2.0 times the number of moles of epoxy groups contained in the entire epoxy resin composition, in a cured resin formed by curing the epoxy resin composition and having a degree of curing of at least 90% obtained by DSC (differential scanning catorimetry), [A], [B] and [C] form a monolayer structure, or a phase separation structure of less than 500 nm. The rubber state modulus of elasticity Y (MPa) and glass transition temperature X (° C.) obtained by DMA (dynamic mechanical analysis) of the cured resin satisfy formula (1).
    Type: Application
    Filed: August 27, 2015
    Publication date: October 26, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ayako FUSE, Nobuyuki TOMIOKA, Shizue KOYANAGI, Nobuyuki ARAI, Shirou HONDA
  • Patent number: 9676936
    Abstract: The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G? of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G? of the material constituting the particles at 160° C. to the storage elastic modulus G? of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: June 13, 2017
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuko Shimizu, Hiroshi Kobayashi, Nobuyuki Tomioka, Hiroshi Takezaki, Shirou Honda
  • Patent number: 9328237
    Abstract: A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: May 3, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shirou Honda
  • Publication number: 20150344686
    Abstract: The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G? of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G? of the material constituting the particles at 160° C. to the storage elastic modulus G? of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].
    Type: Application
    Filed: January 24, 2014
    Publication date: December 3, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuko SHIMIZU, Hiroshi KOBAYASHI, Nobuyuki TOMIOKA, Hiroshi TAKEZAKI, Shirou HONDA
  • Publication number: 20140288214
    Abstract: A two-pack type epoxy resin composition for fiber-reinforced composite materials includes components [A] to [D], with component [D] being a liquid at room temperature or a solid having a melting point of 130° C. or less: [A] an epoxy resin; [B] an acid anhydride; [C] a compound that has an average of 2.5 or more hydroxyphenyl structures in each molecule; and [D] an organic phosphorus compound or imidazole derivative.
    Type: Application
    Filed: October 23, 2012
    Publication date: September 25, 2014
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shirou Honda
  • Publication number: 20140162518
    Abstract: The invention provides a fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition. The prepreg comprises at least constituents [A], [B], and [C] as specified below and reinforcement fiber, wherein 90% or more of constituent [C] exists in the depth range accounting for 20% of the prepreg thickness from the prepreg surface: [A] epoxy resin [B] epoxy resin curing agent [C] polymer particles insoluble in epoxy resin and falling under any of the following [Cx] to [Cz]: [Cx] polymer particles insoluble in epoxy resin and giving a particle diameter distribution chart meeting the following requirements from (x-i) to (x-iii): (x-i) the chart has at least two peaks, (x-ii) the particles giving the two highest peaks have a diameter ratio in the range of 1.
    Type: Application
    Filed: July 25, 2012
    Publication date: June 12, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuko Shimizu, Nobuyuki Tomioka, Shirou Honda, Maki Nagano, Yuji Echigo, Hiroshi Takezaki, Junko Kawasaki, Hiroshi Taiko