Abstract: The present disclosure relates to a production process for a solder electrode, including a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad; a step (2) of forming resist having an opening in a region corresponding to the electrode pad by selectively exposing the coating film to light and further developing the film; a step (3) of heating and/or exposing the resist to light; and a step (4) of filling the opening with molten solder while heating the solder. According to the production process for the solder electrode of the present disclosure, development of cracks on a resist surface can be prevented, and solder filling capability can be improved, even when the resist receives high heat during solder filling as in an IMS method, and therefore the solder electrode adapted for the purpose can be appropriately produced.

Abstract: The present invention relates to a production process for a solder electrode, including: a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad; a step (2) of forming resist having an opening in a region corresponding to the electrode pad by selectively exposing the coating film to light and further developing the film; and a step (3) of filling the opening with molten solder, in which the photosensitive resin composition contains at least a benzoxazole precursor. According to the production process for the solder electrode of the present invention, development of cracks on a resist surface can be prevented, and solder filling capability can be improved, even when the resist receives high heat during solder filling as in an IMS method, and therefore the solder electrode adapted for the purpose can be appropriately produced.

Abstract: A carbazole derivative of the following formula (1), wherein R1 and R2 individually represent a hydrogen atom or a monovalent organic group, or R1 and R2 form, together with the carbon atom to which R1 and R2 bond, a divalent organic group having a 3-8 member carbocyclic structure or a 3-8 member heterocyclic structure, and R3 represents a hydrogen atom or a monovalent organic group. The carbazole derivative is suitable as an additive for increasing sensitivity of a chemically amplified resist. A chemically amplified radiation-sensitive resin composition, useful as a chemically amplified resist, comprising the carbazole derivative is also disclosed.

Abstract: A carbazole derivative of the following formula (1), 1

Abstract: A negative radiation-sensitive resin composition including (A) an alkali-soluble resin containing a copolymer selected from the group consisting of a hydroxystyrene/styrene copolymer having hydroxystyrene units in a content of from 65 to 90 mol % and a hydroxystyrene/&agr;-methylstyrene copolymer having hydroxystyrene units in a content of from 65 to 90 mol %, (B) a radiation-sensitive acid-generating agent containing a hydroxyl group-containing onium salt compound, and (C) a cross-linking agent containing an N-(alkoxymethyl)glycoluril compound. The composition is suitable as a chemically amplified negative resist, to which alkaline developing solutions having usual concentration are applicable and which can form, in usual line-and-space patterns, resist patterns having a rectangular cross-sectional shape in a high resolution and also has superior sensitivity, developability and dimensional fidelity.

Abstract: A radiation-sensitive resin composition exhibiting high sensitivity to various types of radiation and capable of forming a minute pattern with sufficient resolution and depth of field and small surface roughness in various types of patterns such as a dense line pattern, isolated line pattern, or contact holes, particularly in line-type patterns. The resin composition comprises (A) an aromatic sulfonic acid onium salt compound consisting of a 2,4-difluorobenzenesulfonic acid anion, 4-trifluoromethylbenzenesulfonic acid anion, or 2-trifluoromethylbenzenesulfonic acid anion, and an onium cation of sulfur or iodonium, and (B) a copolymer represented by a 4-hydroxystyrene/4-t-butoxystyrene copolymer and a 4-hydroxystyrene/4-(1′-ethoxyethoxy)styrene copolymer.

Abstract: A negative radiation-sensitive resin composition including (A) an alkali-soluble resin containing a copolymer selected from the group consisting of a hydroxystyrene/styrene copolymer having hydroxystyrene units in a content of from 65 to 90 mol % and a hydroxystyrene/&agr;-methylstyrene copolymer having hydroxystyrene units in a content of from 65 to 90 mol %, (B) a radiation-sensitive acid-generating agent containing a hydroxyl group-containing onium salt compound, and (C) a cross-linking agent containing an N-(alkoxymethyl)glycoluril compound. The composition is suitable as a chemically amplified negative resist, to which alkaline developing solutions having usual concentration are applicable and which can form, in usual line-and-space patterns, resist patterns having a rectangular cross-sectional shape in a high resolution and also has superior sensitivity, developability and dimensional fidelity.