Abstract: A technique capable of enhancing a reliability of a semiconductor device is provided. A semiconductor device has a die pad on which a semiconductor chip is mounted. The die pad is sealed with resin so that a lower surface located on an opposite side of an upper surface on which the semiconductor chip is mounted is exposed. Also, the die pad has a central part including a region in which the semiconductor chip is mounted and a peripheral edge part provided next to the central part in a planar view. In addition, a step surface formed so that a height of the peripheral edge part becomes higher than a height of the central part is provided at a boundary between the central part and the peripheral edge part.

Abstract: A technique capable of enhancing a reliability of a semiconductor device is provided. A semiconductor device has a die pad on which a semiconductor chip is mounted. The die pad is sealed with resin so that a lower surface located on an opposite side of an upper surface on which the semiconductor chip is mounted is exposed. Also, the die pad has a central part including a region in which the semiconductor chip is mounted and a peripheral edge part provided next to the central part in a planar view. In addition, a step surface formed so that a height of the peripheral edge part becomes higher than a height of the central part is provided at a boundary between the central part and the peripheral edge part.

Abstract: A semiconductor device of the present invention includes a lead frame having an island portion having a roughened upper surface and side faces, and an unroughened lower surface, and also having a plurality of leads having roughened inner lead portions and unroughened outer lead portions; a semiconductor chip placed on the upper surface of the island portion of the lead frame; a plurality of electrode pads provided on the upper surface of the semiconductor chip; a plurality of wires connecting the plurality of electrode pads and the plurality of leads; and a resin molding the semiconductor chip.