Patents by Inventor Shirou Takigawa

Shirou Takigawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vacuum Film Forming Apparatus
    Publication number: 20080289957
    Abstract: A vacuum film forming apparatus is provided that is intended to use a portion of its cylindrical member as a target and moreover have an additional function of plasma polymerization using the cylindrical member. A vacuum film forming apparatus (100) is provided with an electrically conductive vacuum chamber (13) having an interior space, a frame member (15) having a plurality of curved members (31, 32) each curved in a sector shape and arranged in the interior space (10) so as to form a substantially cylindrical shape, and a magnetic field forming device (33) disposed in an interior surrounded by the frame member (15) and configured to form a magnetic field along the circumference of the frame member (15). At least one of the curved members (15, 16) is a target used for sputtering, and a region of the frame member (15) other than the target is used for plasma polymerization.
    Type: Application
    Filed: September 5, 2005
    Publication date: November 27, 2008
    Inventors: Shirou Takigawa, Keiji Katou, Nobuo Yoneyama
  • Method and system of forming semiconductor wiring, method and system of fabricating semiconductor device, and wafer
    Publication number: 20050199983
    Abstract: A vacuum chamber the inside of which can be maintained in a substantially vacuum condition is used; a wafer in which a semiconductor wiring film is to be formed is held by a wafer substrate holder disposed in the vacuum chamber; the material of the semiconductor wiring film is evaporated by an evaporation source disposed in the vacuum chamber; and a high frequency electric power for generating a plasma in the vacuum chamber, making use of the substrate holder as an electrode is supplied from a high frequency power source.
    Type: Application
    Filed: April 6, 2005
    Publication date: September 15, 2005
    Applicant: SHINMAYWA INDUSTRIES, LTD.
    Inventors: Masao Marunaka, Toshiya Doi, Kouichi Nose, Shirou Takigawa, Kiyoshi Otake
  • Method and system of forming semiconductor wiring, method and system of fabrication semiconductor device, and wafer
    Publication number: 20030153180
    Abstract: A vacuum chamber the inside of which can be maintained in a substantially vacuum condition is used; a wafer in which a semiconductor wiring film is to be formed is held by a wafer substrate holder disposed in the vacuum chamber; the material of the semiconductor wiring film is evaporated by an evaporation source disposed in the vacuum chamber; and a high frequency electric power for generating a plasma in the vacuum chamber, making use of the substrate holder as an electrode is supplied from a high frequency power source.
    Type: Application
    Filed: December 16, 2002
    Publication date: August 14, 2003
    Applicant: SHINMAYWA INDUSTRIES, LTD.
    Inventors: Masao Marunaka, Toshiya Doi, Kouichi Nose, Shirou Takigawa, Kiyoshi Otake
  • Arc evaporator, method for driving arc evaporator, and ion plating apparatus
    Patent number: 6579428
    Abstract: An arc evaporator comprises: an anode; an evaporation source electrode as a cathode; and a current control unit for supplying an AC square wave arcing current across the anode and the evaporation source electrode.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: June 17, 2003
    Assignees: Shinmaywa Industries, Ltd., Citizen Watch Co., Ltd.
    Inventors: Shirou Takigawa, Kouichi Nose, Yasuhiro Koizumi, Takanobu Hori, Yukio Miya
  • Arc evaporator, method for driving arc evaporator, and ion plating apparatus
    Publication number: 20020046941
    Abstract: An arc evaporator comprises: an anode; an evaporation source electrode as a cathode; and a current control unit for supplying an AC square wave arcing current across the anode and the evaporation source electrode.
    Type: Application
    Filed: September 26, 2001
    Publication date: April 25, 2002
    Inventors: Shirou Takigawa, Kouichi Nose, Yasuhiro Koizumi, Takanobu Hori, Yukio Miya
  • Apparatus and method for laser fusion bonding
    Patent number: 6373025
    Abstract: A laser fusion bonding apparatus includes a laser beam irradiation unit for emitting a laser beam with which portions of two works which are in contact with or close to each other are irradiated, and thereby fusion bonded. The laser beam is a substantially-parallel laser beam.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: April 16, 2002
    Assignees: Shinmaywa Industries, Ltd., Nippon Sheet Glass Co., Ltd.
    Inventors: Kiyoshi Takeuchi, Shirou Takigawa, Takahiko Kondou, Takashi Hosoya, Yasukuni Iwasaki, Koichi Abe