Abstract: A carrier of a camera module to receive glue for fixing a lens structure thereon comprises a glue dispensing area, the glue dispensing area comprises a bonding area and a groove extending outwards from the bonding area, the groove is directly adjacent to the bonding area to receive glue overflowing from the glue dispensing area. The groove prevents glue dispensed in the bonding area from overflowing towards, or entering, the center of the carrier and improves the production quality of the camera module. The application also discloses a camera module including the above camera carrier.

Abstract: A heat dissipating base for a light-emitting element sufficient to dissipate generated heat without additional means of dissipating includes a first base plate and a second base plate formed on the first base plate. The first base plate includes first sidewalls. The second base plate includes second sidewalls. The first base plate defines a first groove, the first groove passes through one first sidewall to form a first cutout. The second base plate defines a second groove, the second groove passes through one second sidewall to form a second cutout. The first cutout and the second cutout correspond to each other and cooperatively form a heat dissipating opening. The first groove and the second groove correspond to each other and cooperatively form a channel for dissipating heat. A light emitting device having such heat dissipating base is also provided.