Patents by Inventor Shitiz Arora

Shitiz Arora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11290109
    Abstract: A MOS IC includes a MOS logic cell that includes first and second sets of transistor logic in first and second subcells, respectively. The first and second sets of transistor logic are functionally isolated from each other. The MOS logic cell includes a first set of Mx layer interconnects on an Mx layer extending in a first direction over the first and second subcells. A first subset of the first set of Mx layer interconnects is coupled to inputs/outputs of the first set of transistor logic in the first subcell and is unconnected to the second set of transistor logic. Each of the first subset of the first set of Mx layer interconnects extends from the corresponding input/output of the first set of transistor logic of the first subcell to the second subcell, and is the corresponding input/output of the first set of transistor logic.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: March 29, 2022
    Assignee: QUALCOMM INCORPORATED
    Inventors: Foua Vang, Hyeokjin Lim, Seung Hyuk Kang, Venugopal Boynapalli, Shitiz Arora
  • Publication number: 20220094363
    Abstract: A MOS IC includes a MOS logic cell that includes first and second sets of transistor logic in first and second subcells, respectively. The first and second sets of transistor logic are functionally isolated from each other. The MOS logic cell includes a first set of Mx layer interconnects on an Mx layer extending in a first direction over the first and second subcells. A first subset of the first set of Mx layer interconnects is coupled to inputs/outputs of the first set of transistor logic in the first subcell and is unconnected to the second set of transistor logic. Each of the first subset of the first set of Mx layer interconnects extends from the corresponding input/output of the first set of transistor logic of the first subcell to the second subcell, and is the corresponding input/output of the first set of transistor logic.
    Type: Application
    Filed: September 23, 2020
    Publication date: March 24, 2022
    Inventors: Foua VANG, Hyeokjin LIM, Seung Hyuk KANG, Venugopal BOYNAPALLI, Shitiz ARORA
  • Publication number: 20170300608
    Abstract: A method includes providing a semiconductor interconnect implementation tool, and designing, using any one, a combination or all of the self-aligned double-patterning-friendly rule(s) described herein and in conjunction with the semiconductor interconnect implementation tool, at least two routing layers, each routing layer having routing lines, the routing lines including line(s) having a default width and line(s) having a non-default width. A system and program product corresponding to the method are also provided.
    Type: Application
    Filed: November 8, 2016
    Publication date: October 19, 2017
    Inventors: Haritez NARISETTY, John LEE, Shitiz ARORA
  • Patent number: 9378325
    Abstract: A method of performing layout verification for an integrated circuit (IC) layout is described. The method comprises receiving layout information for the IC layout, identifying at least one IC component within the IC layout, extracting localized layout information for the at least one IC component from the received layout information, defining the localized layout information for the at least one IC component within at least one component instance parameter therefor, and performing at least one layout verification check for the at least one component based at least partly on the at least one component instance parameter.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: June 28, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Xavier Hours, Shitiz Arora, Robert Scott Ruth
  • Publication number: 20140380258
    Abstract: A method of performing layout verification for an integrated circuit (IC) layout is described. The method comprises receiving layout information for the IC layout, identifying at least one IC component within the IC layout, extracting localised layout information for the at least one IC component from the received layout information, defining the localised layout information for the at least one IC component within at least one component instance parameter therefor, and performing at least one layout verification check for the at least one component based at least partly on the at least one component instance parameter.
    Type: Application
    Filed: February 23, 2012
    Publication date: December 25, 2014
    Applicant: Freescale Semiconductor, Inc
    Inventors: Xavier Hours, Shitiz Arora, Robert Scott Ruth