Patents by Inventor Shiu-Chih WANG

Shiu-Chih WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SYSTEM AND ELECTROLESS PLATING METHOD OF THE SAME
    Publication number: 20220056589
    Abstract: An electroless semiconductor bonding structure, an electroless plating system and an electroless plating method of the same are provided. The electroless semiconductor bonding structure includes a first substrate and a second substrate. The first substrate includes a first metal bonding structure disposed adjacent to a first surface of the first substrate. The second substrate includes a second metal bonding structure disposed adjacent to a second surface of the second substrate. The first metal bonding structure connects to the second metal bonding structure at an interface by electroless bonding and the interface is substantially void free.
    Type: Application
    Filed: August 21, 2020
    Publication date: February 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Wei CHIANG, Shin-Luh TARNG, Chih-Pin HUNG, Shiu-Chih WANG, Yong-Da CHIU
  • Semiconductor packages
    Patent number: 10872861
    Abstract: A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: December 22, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG, TAIWAN
    Inventors: Yong-Da Chiu, Shiu-Chih Wang, Shang-Kun Huang, Ying-Ta Chiu, Shin-Luh Tarng, Chih-Pin Hung
  • SEMICONDUCTOR PACKAGES
    Publication number: 20190244909
    Abstract: A semiconductor package includes an electrical connection structure. The electrical connection structure includes: a first conductive layer; a second conductive layer on the first conductive layer; and a conductive cap between the first conductive layer and the second conductive layer, the conductive cap having a hardness greater than a hardness of the first conductive layer.
    Type: Application
    Filed: February 7, 2018
    Publication date: August 8, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yong-Da CHIU, Shiu-Chih WANG, Shang-Kun HUANG, Ying-Ta CHIU, Shin-Luh TARNG, Chih-Pin HUNG
  • POLYLACTIC ACID RESIN COMPOSITION AND APPLICATION THEREOF
    Publication number: 20190127573
    Abstract: A polylactic acid resin composition includes about 100 parts by weight of a polylactic acid resin, about 0.001 to about 3 parts by weight of a nucleating agent and about 3 to about 70 parts by weight of a filler. The polylactic acid resin composition can be processed into a biodegradable molded article or other product having a high impact strength and a high heat deflection temperature.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 2, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chean-Cheng SU, Chih-Pin HUNG, Shin-Luh TARNG, Chaung Chi WANG, Chao Ming TSENG, Shiu-Chih WANG