Patents by Inventor Shiu-Chin Su

Shiu-Chin Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9932437
    Abstract: Moisture-curable resin compositions comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and cured compositions produced by contacting such resin compositions with water are disclosed. The moisture-curable resin composition is useful in the production of adhesives, including hot melt adhesives, primers, sealants, and coatings.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: April 3, 2018
    Assignee: Momentive Performance Materials Inc.
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Pohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt, Thomas Fay-Oy Lim, Vikram Kumar
  • Patent number: 9714315
    Abstract: A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: July 25, 2017
    Assignee: Momentive Performance Materials Inc.
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Pohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt
  • Patent number: 9243152
    Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: January 26, 2016
    Assignee: Momentive Performance Materials Inc.
    Inventors: Narayana Padmanabha Iyer, Lesley Hwang, Vikram Kumar, Christian Geismann, Constantine Kondos, Shiu-Chin Su
  • Publication number: 20140323650
    Abstract: A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
    Type: Application
    Filed: July 9, 2014
    Publication date: October 30, 2014
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Rohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt
  • Patent number: 8809479
    Abstract: A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting a agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: August 19, 2014
    Assignee: Momentive Performance Materials Inc.
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Pohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt
  • Publication number: 20140221531
    Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.
    Type: Application
    Filed: April 8, 2014
    Publication date: August 7, 2014
    Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Narayana Padmanabha Iyer, Lesley Hwang, Vikram Kumar, Christian Geismann, Constantine Kondos, Shiu-Chin Su
  • Patent number: 8728345
    Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: May 20, 2014
    Assignee: Momentive Performance Materials Inc.
    Inventors: Narayana Padmanabha Iyer, Lesley Hwang, Vikram Kumar, Christian Geismann, Constantine Kondos, Shiu-Chin Su
  • Publication number: 20130245194
    Abstract: Moisture-curable resin compositions comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and cured compositions produced by contacting such resin compositions with water are disclosed. The moisture-curable resin composition is useful in the production of adhesives, including hot melt adhesives, primers, sealants, and coatings.
    Type: Application
    Filed: September 10, 2012
    Publication date: September 19, 2013
    Applicant: Momentive Performance Materials Inc.
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Pohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt, Thomas Fay-Oy Lim, Vikram Kumar
  • Publication number: 20130158159
    Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 20, 2013
    Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Narayana Padmanabha Iyer, Lesley Hwang, Vikram Kumar, Christian Geismann, Constantine Kondos, Shiu-Chin Su
  • Publication number: 20100317796
    Abstract: A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and reactive modifier (b) under curing conditions; and optionally, the composition can contain one or more conventional components, including pigments, fillers, curing catalysts, dyes, plasticizers, thickeners, coupling agents, extenders, volatile organic solvents, wetting a agents, tackifiers, crosslinking agents, thermoplastic polymers, ultraviolet stabilizers, and combination thereof. The moisture-curable resin composition is useful in the production of adhesives including hot melt adhesives, primers, sealants and coatings.
    Type: Application
    Filed: April 26, 2010
    Publication date: December 16, 2010
    Inventors: Misty Huang, Richard W. Cruse, Benjamin Falk, Eric Pohl, Shiu-Chin Su, Jeries Nesheiwat, Philbert Ramdatt
  • Publication number: 20060228470
    Abstract: Conversion and passivation coatings and methods for metal surfaces such as steel and aluminum are disclosed. The coating compositions comprise an aqueous sol of cerium oxide and/or silica particles and a ureido silane compound. The methods of the invention comprise contacting the requisite metal surface with the coating composition.
    Type: Application
    Filed: November 30, 2005
    Publication date: October 12, 2006
    Applicant: General Electric Company
    Inventors: Lingyun He, Donald Whisenhunt, Jeffrey Melzer, Andrea Eodice, Bret Chisholm, Christopher Carter, Shiu-Chin Su, Kendall Guyer, Matthew Hunter
  • Patent number: 5155233
    Abstract: Compositions are provided containing epoxysilanes and diphenylamine in an amount at least sufficient to inhibit degradation. Methods for producing such compositions are also provided.
    Type: Grant
    Filed: December 24, 1991
    Date of Patent: October 13, 1992
    Assignee: Union Carbide Chemicals & Plastics Technology Corporation
    Inventors: Shiu-Chin Su, Frederick D. Osterholtz