Patents by Inventor Shiu-Fang Yen

Shiu-Fang Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230026633
    Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.
    Type: Application
    Filed: October 4, 2022
    Publication date: January 26, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shiu-Fang YEN, Chang-Lin YEH, Jen-Chieh KAO
  • Semiconductor package device and method of manufacturing the same
    Patent number: 11462455
    Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: October 4, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shiu-Fang Yen, Chang-Lin Yeh, Jen-Chieh Kao
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190393126
    Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.
    Type: Application
    Filed: January 30, 2019
    Publication date: December 26, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shiu-Fang YEN, Chang-Lin YEH, Jen-Chieh KAO
  • Image sensor and fabrication method thereof
    Publication number: 20090189055
    Abstract: Embodiments disclose an image sensor device, comprising a substrate comprising a plurality of photosensor cells located therein or thereon, a plurality of optical guide structures corresponding to the photosensor cells respectively, and a stacked layer surrounding the optical guide structures, comprising a plurality of top portions with sharp corners adjacent to the top edges of the optical guide structures.
    Type: Application
    Filed: January 25, 2008
    Publication date: July 30, 2009
    Inventors: Chien-Pang Lin, Chung-Jung Hsu, Shiu-Fang Yen, Wu-Chieh Liu
  • Image sensor device and fabrication method thereof
    Publication number: 20090101947
    Abstract: An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel array therein. A first transparent layer with a curved surface is disposed on the substrate. A micro lens array is conformally disposed on the curved surface of the first transparent layer and corresponds to the pixel array in the substrate. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
    Type: Application
    Filed: October 17, 2007
    Publication date: April 23, 2009
    Inventors: Chien-Pang Lin, Chin-Poh Pang, Wu-Chieh Liu, Shiu-Fang Yen