Patents by Inventor Shiu-Tai Tzung

Shiu-Tai Tzung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cavity-down ball grid array package with semiconductor chip solder ball
    Patent number: 6650015
    Abstract: A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 18, 2003
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Eing-Chieh Chen, Shiu-Tai Tzung, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien
  • Cavity-down ball grid array package with semiconductor chip solder ball
    Publication number: 20030146508
    Abstract: A cavity-down ball grid array package includes a substrate having a through cavity provided therein. A heat sink is attached to the substrate and a semiconductor chip in the cavity is attached to the heat sink and electrically connected to the substrate. A ball grid array is on the substrate and on the semiconductor chip.
    Type: Application
    Filed: June 14, 2002
    Publication date: August 7, 2003
    Inventors: Eing-Chieh Chen, Shiu-Tai Tzung, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien