Abstract: A stereoscopic touch display device includes a display panel and a stereoscopic touch panel. The stereoscopic touch panel includes a first substrate, a second substrate, a liquid crystal layer, receiver electrodes, transmitter electrodes, common electrodes, a signal driver, and a common potential providing unit. The liquid crystal layer is disposed between the first and second substrates. The receiver electrodes and the common electrodes are disposed on the first substrate. The transmitter electrodes are disposed on the second substrate. The signal driver is electrically connected to the transmitter electrodes and the receiver electrodes. The signal driver is configured for providing transmitting touch signals to the transmitter electrodes and detecting receiving touch signals generated from coupling capacitances between the receiver electrodes and the transmitter electrodes in sequence.

Abstract: A stereoscopic touch display device includes a display panel and a stereoscopic touch panel. The stereoscopic touch panel includes a first substrate, a second substrate, a liquid crystal layer, receiver electrodes, transmitter electrodes, common electrodes, a signal driver, and a common potential providing unit. The liquid crystal layer is disposed between the first and second substrates. The receiver electrodes and the common electrodes are disposed on the first substrate. The transmitter electrodes are disposed on the second substrate. The signal driver is electrically connected to the transmitter electrodes and the receiver electrodes. The signal driver is configured for providing transmitting touch signals to the transmitter electrodes and detecting receiving touch signals generated from coupling capacitances between the receiver electrodes and the transmitter electrodes in sequence.

Abstract: A barrier film for blocking moisture and oxygen transmission includes a single layer grown from a precursor of organic silicide by a chemical vapor deposition, having at least silicon (Si) atoms, oxygen (O) atoms and carbon (C) atoms with atomic ratios of C/Si in a range of about 0.1-0.5, and O/Si in a range of about 2.0-2.5. The Si and O atoms form four bonding structures: Si(—O)4, Si(—O)3, Si(—O)2, and Si(—O)1, in the single layer. In the total amount of the four bonding structures being 100%, the bonding structures of Si(—O)4, Si(—O)3, Si(—O)2, and Si(—O)1 are in ranges of about 50%-99.9%, 0.01%-50%, 0%-10%, and 0%-10%, respectively.

Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.

Abstract: A display device includes a first flexible substrate, a second flexible substrate and a patterned sealant. The patterned sealant is disposed between the first flexible substrate and the second flexible substrate. The patterned sealant includes a hollow rectangular pattern, which is disposed in a peripheral region of the first flexible substrate, and has a rectangular opening corresponding to an active region of the first flexible substrate. The rectangular opening has a long side parallel to a first direction and a short side parallel to a second direction, and the long side has a long side length x1 and the short side has a short side length y1. The hollow rectangular pattern has a first width x2 in the first direction, and a second width y2 in the second direction, wherein y2?x2, y1?x1 and 10?y1/y2?90.

Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.