Patents by Inventor Shiuh-Hui Chen

Shiuh-Hui Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050252755
    Abstract: An acceleration switch and method therefor includes providing a conductive substrate and an insulating cap. A recessed area is formed in the insulating cap. An insulating layer is disposed on the conductive substrate. A conductive layer is disposed on the insulating layer. The conductive layer is etched to form a cantilever beam and an electrically isolated island. The insulating layer is etched around the cantilever beam to free the cantilever beam to move. Contacts are disposed on the cantilever beam and in the recessed area such that the contacts are able to electrically contact each other upon application of an acceleration to the switch. The cap is bonded to the conductive layer to hermetically seal the cantilever beam.
    Type: Application
    Filed: May 13, 2004
    Publication date: November 17, 2005
    Inventors: Shiuh-Hui Chen, Jen-Huang Chiou, Carl Ross
  • Patent number: 5365790
    Abstract: A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519). In a more specific embodiment a capacitive pressure sensor is disclosed. This capacitive pressure sensor has a sealed chamber (125) and is further constructed with a conductive substrate (509) having an electrically insulating layer (515) disposed thereon.
    Type: Grant
    Filed: April 2, 1992
    Date of Patent: November 22, 1994
    Assignee: Motorola, Inc.
    Inventors: Shiuh-Hui Chen, Carl Ross, Roseann M. Tomasello, Anita G. Brandes
  • Patent number: 5173836
    Abstract: A hermetically sealed interface is constructed with a substrate (101) having a first surface (103) with a first orifice (201). The substrate (101) also has an opposing second surface (105) with a second orifice (205). The first and second orifices (201, 205) are connected via a passageway (107). The passageway (107) has an inner surface (209) with a first metal coating (111). The first metal coating (111) and the substrate (101) provide a first predetermined thermal coefficient of expansion for the passageway (107). A plug (221) with an outer surface (223) has a second metal coating (225). The second metal coating (225) and the plug (221) provide a second predetermined thermal coefficient of expansion substantially similar to the first predetermined thermal coefficient of expansion of the passageway (107). The plug (221) is disposed in the passageway (107) of the substrate (101).
    Type: Grant
    Filed: March 5, 1992
    Date of Patent: December 22, 1992
    Assignee: Motorola, Inc.
    Inventors: Joseph P. Tomase, Shiuh-Hui Chen, Gregory D. Stamm, Marc K. Chason