Abstract: An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.

Abstract: A method of manufacturing an encapsulation structure for encapsulating an LED chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the LED chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation.

Abstract: A method of manufacturing a light emitting device package, includes following steps: providing a base which having a first surface and an opposite second surface, and electrical structures formed on the first surface, defining two through holes through the first and second surfaces; mounting a light emitting element on the first surface, the light emitting element having one pad on a top surface thereof; forming a mask on the first surface, the mask covering the light emitting element and defining at least one opening for exposing the at least one pad; electrically connecting the at least one pad to the electrical structures via at least one metal wire; filling liquid encapsulating material in a space between the mask and the first surface to form an encapsulating layer that encapsulating the light emitting element, the encapsulating layer being separated from the at least one metal wire and comprising phosphors therein.

Abstract: An LED package includes a light transmissive encapsulation, an LED die, a fluorescent layer, a baffle wall, a positive electrode and a negative electrode. The encapsulation includes a light emitting surface and a bottom surface opposite to the light emitting surface. The LED die, the fluorescent layer and the baffle wall are embedded in the encapsulation from the bottom surface side. The LED die includes a front surface for outputting light outward and a back surface opposite to the front surface. The front surface faces the light emitting surface of the encapsulation, and the back surface is exposed outside. The fluorescent layer is formed on the front surface of the LED die. The baffle wall surrounds the LED die and the fluorescent layer. The positive electrode and negative electrode are electrically connected to the LED die.

Abstract: A light emitting device package includes a base, a light emitting element, a mask, metal wires, an encapsulating layer and a cover layer. The base has a first surface bearing electrical structure thereon and an opposite second surface. The mask is arranged on the first surface to define a space receiving the light emitting element. Two openings are defined in the mask. The light emitting element has two pads exposed to an outside through the two openings respectively. The metal wires electrically connect the pads and the electrical structures. The encapsulating layer is filled in the space and two through holes in the base and encapsulates the light emitting element. The encapsulating layer is separated from the metal wires. The cover layer covers and protects the mask and the metal wires. A method of manufacturing the package is also provided.

Abstract: A method of manufacturing an encapsulation structure for encapsulating an LED chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the LED chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation.

Abstract: An LED module includes a plurality of lighting sources each including a substrate, a first and second lead frames arranged on the substrate, an LED chip electrically connected to the first and the second lead frames, and an encapsulation covering the LED chip. The first lead frame of each of the lighting sources connects with the second lead frame of an adjacent lighting source electrically and mechanically.

Abstract: An exemplary encapsulation structure for encapsulating an LED chip includes a first encapsulation, a second encapsulation and a transparent resin layer with phosphorous compounds doped therein. The first encapsulation defines a receiving room for receiving the LED chip therein. The second encapsulation defines a receiving space for receiving the first encapsulation therein. The second encapsulation is separated from the first encapsulation to define a clearance between the first encapsulation and the second encapsulation. The transparent resin layer is filled in the clearance. The transparent resin layer has a uniform thickness.

Abstract: The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package.

Abstract: An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.

Abstract: A method for distributing phosphor particulates on an LED chip, includes steps of: providing a substrate having an LED chip mounted thereon; dispensing an adhesive on the chip, wherein the adhesive have positively charged phosphor particulates doped therein; providing an upper mold and a lower mold for producing an electric field through the adhesive and moving the upper mold to press the adhesive, wherein the phosphor particulates are driven by the electric field to move to a top face of the chip; and curing the adhesive and removing the upper mold and the lower mold.

Abstract: An LED package includes a substrate, an LED chip and an encapsulation. The substrate includes a main plate, and a first soldering pad and a second soldering pad attached to the main plate. The first soldering pad and the second soldering pad are separated from each other. The LED chip includes a first electrode and a second electrode. The LED chip is mounted on the substrate with the second electrode electrically connected to the second soldering pad of the substrate. The encapsulation includes a main body enclosing the LED chip and an electric connecting unit electrically connecting the first electrode of the LED chip and the first soldering pad.

Abstract: An LED unit includes an LED and an optical element. The LED includes a substrate, an LED chip fixed on the substrate and an encapsulation encapsulating the LED chip. The LED further includes a first magnet fixed on the substrate. The optical element includes an optical adjustment layer and a second magnet. The second magnet attracts the first magnet to fix the optical element on the LED. The LED unit can be adjusted to have different optical characteristics by replacing the optical element thereof with another optical element.

Abstract: An LED unit includes a plurality of LEDs connected to each other and a plate supporting the LEDs. Each LED includes a base, a chip mounted on the base, a pair of leads fixed to the base and electrically connected to the chip and an encapsulant sealing the chip. The base includes a main body and a pair of steps. The leads each have two opposite ends protruding from two opposite ends of the main body and located below/above a corresponding step. The protruding ends of the leads of each LED are connected to those of adjacent LEDs to electrically connect the LEDs in series or in parallel.

Abstract: An LED module includes a substrate comprising a base plate and an elastic arm extending from a periphery side of the base plate. The elastic arm includes a horizontal portion parallel to and spaced from the base plate. A receiving space is defined between the horizontal portion of the elastic arm and the base plate. A circuit layer is formed on the base plate. An LED is mounted on the base plate and electrically connects with the circuit layer. The LED comprises a base and at least one electrode extending outwardly from the base. The LED is fixed on the substrate via the at least one electrode slideably received in the receiving space with a downward force applied on the electrode by the horizontal portion of the elastic arm.

Abstract: An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED.

Abstract: The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package.

Abstract: The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package.

Abstract: An LED package includes a light transmissive encapsulation, an LED die, a fluorescent layer, a baffle wall, a positive electrode and a negative electrode. The encapsulation includes a light emitting surface and a bottom surface opposite to the light emitting surface. The LED die, the fluorescent layer and the baffle wall are embedded in the encapsulation from the bottom surface side. The LED die includes a front surface for outputting light outward and a back surface opposite to the front surface. The front surface faces the light emitting surface of the encapsulation, and the back surface is exposed outside. The fluorescent layer is formed on the front surface of the LED die. The baffle wall surrounds the LED die and the fluorescent layer. The positive electrode and negative electrode are electrically connected to the LED die.

Abstract: An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.