Abstract: A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.

Abstract: A strain monitoring system including an array of semiconductor strain gauges. Each strain gauge in the array of strain gauges includes a lithographically fabricated 4-resistor bridge for providing a voltage potential corresponding to the strain in the bridge and thin film transistors to provide addressability to each 4-resistor bridge in the array. After completion of the array of strain gauges, in preferred embodiments the array of strain gauges are transferred to polyimide film which is in turn bonded to a surface region of the component to be tested for strains. Each bridge provides voltage signals corresponding to the strain to which the material under the bridge is being subjected. In preferred embodiments control and data acquisition function are separated from the semiconductor strain gage array. Preferred embodiments the system are utilized to monitor strains on components of aircraft, especially light weight robotic aircraft.

Abstract: A transformable skin. The transformable skin includes a first mechanism for enabling a first type of deformation of the skin. A second mechanism resists a second type of deformation that is different than the first type of deformation in direction or form. In a more specific embodiment, the first mechanism and the second mechanism are interconnected. The first type of deformation is strain deformation along a first path that is inline with a first axis of the skin. In the specific embodiment, the second type of deformation includes shear deformation and strain deformation that is inline with a second axis that is approximately perpendicular to the first axis. The first mechanism includes a plural partially planar spring structures arranged parallel to each other. The plural partially planar spring structures are resistant to bending and are interconnected via rigid connecting structures. The spring structures are partially planar, and the connecting structures are covered with an elastomeric material.