Patents by Inventor Shiva Ramesh

Shiva Ramesh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6770947
    Abstract: A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The vertically configured structure may be a reduced vertical thickness of the severable portion, an elevated lower surface of the severable portion above adjoining portions of the fuse link, a protrusion which supports the severable portion at a height greater than a height of the adjoining portions of the fuse link, flowing the melted severable portion down sloped surfaces away from a break point, and a propellent material beneath the severable portion which explodes to ablate the severable portion.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: August 3, 2004
    Assignee: LSI Logic Corporation
    Inventors: Gary K. Giust, Ruggero Castagnetti, Yauh-Ching Liu, Shiva Ramesh
  • Publication number: 20030155629
    Abstract: A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The vertically configured structure may be a reduced vertical thickness of the severable portion, an elevated lower surface of the severable portion above adjoining portions of the fuse link, a protrusion which supports the severable portion at a height greater than a height of the adjoining portions of the fuse link, flowing the melted severable portion down sloped surfaces away from a break point, and a propellent material beneath the severable portion which explodes to ablate the severable portion.
    Type: Application
    Filed: February 12, 2003
    Publication date: August 21, 2003
    Inventors: Gary K. Giust, Ruggero Castagnetti, Yauh-Ching Liu, Shiva Ramesh
  • Patent number: 6566730
    Abstract: A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The vertically configured structure may be a reduced vertical thickness of the severable portion, an elevated lower surface of the severable portion above adjoining portions of the fuse link, a protrusion which supports the severable portion at a height greater than a height of the adjoining portions of the fuse link, flowing the melted severable portion down sloped surfaces away from a break point, and a propellent material beneath the severable portion which explodes to ablate the severable portion.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: May 20, 2003
    Assignee: LSI Logic Corporation
    Inventors: Gary K. Giust, Ruggero Castagnetti, Yauh-Ching Liu, Shiva Ramesh