Patents by Inventor Shivam AGARWAL
Shivam AGARWAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240101158Abstract: Systems and techniques are described herein for determining at least one location of at least one target vehicle relative to a lane. For instance, a method for determining at least one location of at least one target vehicle relative to a lane is provided.Type: ApplicationFiled: June 16, 2023Publication date: March 28, 2024Inventors: Shivam AGARWAL, Avdhut JOSHI, Jayakrishnan UNNIKRISHNAN, Yoga Y NADARAAJAN, Sree Sesha Aravind VADREVU, Gautam SACHDEVA
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Publication number: 20240096111Abstract: Systems and techniques are described herein for determining lane associations of target vehicles. For instance, a method for determining lane associations of target vehicles is provided. The method may include obtaining a two-dimensional bounding box defining a position within an image frame that is associated with a target vehicle; obtaining lane markers defining a position within the image frame that is associated with at least one lane boundary; and associating a lane with the target vehicle based on a relationship between the two-dimensional bounding box and the lane markers.Type: ApplicationFiled: June 16, 2023Publication date: March 21, 2024Inventors: Shivam AGARWAL, Avdhut JOSHI, Jayakrishnan UNNIKRISHNAN, Yoga Y NADARAAJAN, Sree Sesha Aravind VADREVU, Gautam SACHDEVA
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Patent number: 11909607Abstract: Systems and methods are provided for addressing issues caused by interruptions that may occur while operating under the Metro Ethernet Forum (MEF) 35.1 standard. A method, according to one implementation, includes obtaining PM data during a current Measurement Interval of an ongoing PM session in accordance with MEF 35.1. The PM data can be locally stored as a current dataset and reported at the end of the current Measurement Interval for storage in a history database. Following an interruption event that interrupts at least the current Measurement Interval, the method detects a recommencement event that clears the interruption event and allows a PM session to resume. The method further includes determining a number of Measurement Intervals affected by the interruption event based on an end time of a last-reported Measurement Interval and then inserting the number of affected Measurement Intervals into the history database after the last-reported Measurement Interval.Type: GrantFiled: September 23, 2022Date of Patent: February 20, 2024Assignee: Ciena CorporationInventors: Shivam Agarwal, Aditya Yadav, Jai Kumar
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Publication number: 20240048464Abstract: Systems and methods are provided for addressing issues caused by interruptions that may occur while operating under the Metro Ethernet Forum (MEF) 35.1 standard. A method, according to one implementation, includes obtaining PM data during a current Measurement Interval of an ongoing PM session in accordance with MEF 35.1. The PM data can be locally stored as a current dataset and reported at the end of the current Measurement Interval for storage in a history database. Following an interruption event that interrupts at least the current Measurement Interval, the method detects a recommencement event that clears the interruption event and allows a PM session to resume. The method further includes determining a number of Measurement Intervals affected by the interruption event based on an end time of a last-reported Measurement Interval and then inserting the number of affected Measurement Intervals into the history database after the last-reported Measurement Interval.Type: ApplicationFiled: September 23, 2022Publication date: February 8, 2024Inventors: Shivam Agarwal, Aditya Yadav, Jai Kumar
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Publication number: 20230240836Abstract: Disclosed are adjustable intraocular lenses and methods of adjusting intraocular lenses post-operatively. In one embodiment, an adjustable accommodating intraocular lens comprises an optic portion and at least one haptic. At least part of the haptic can be made in part of a composite material comprising an energy absorbing constituent and a plurality of shrinkable and/or burstable microspheres. At least one of a base power of the optic portion can be configured to change in response to an external energy directed at the composite material.Type: ApplicationFiled: January 12, 2023Publication date: August 3, 2023Applicant: Alcon Inc.Inventors: Sean Michael IRBY, Shivam AGARWAL
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Patent number: 11630197Abstract: Disclosed are techniques for determining a motion state of a target object. In an aspect, an on-board computer of an ego vehicle detects the target object in one or more images, determines one or more first attributes of the target object based on measurements of the one or more images, determines one or more second attributes of the target object based on measurements of a map of a roadway on which the target object is travelling, and determines the motion state of the target object based on the one or more first attributes and the one or more second attributes of the target object.Type: GrantFiled: January 2, 2020Date of Patent: April 18, 2023Assignee: QUALCOMM IncorporatedInventors: Jayakrishnan Unnikrishnan, Avdhut Joshi, Shivam Agarwal, Amir Salimi, Sree Sesha Aravind Vadrevu, Gautam Sachdeva, Yoga Y Nadaraajan, Ravi Teja Sukhavasi, Xinzhou Wu, Young-Ki Baik, Duck Hoon Kim, Hyun-Mook Cho
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Patent number: 11461915Abstract: Techniques and systems are provided for determining one or more sizes of one or more objects. For example, a bounding region identifying a first object detected in an image can be obtained. A map including map points can also be obtained. The map points correspond to one or more reference locations in a three-dimensional space. The bounding region identifying the first object can be associated with at least one map point of the map points included in the map. Using the bounding region and the at least one map point, an estimated three-dimensional position and an estimated size of the first object detected in the image can be determined. In some examples, other information can be used to estimate the estimated three-dimensional position and an estimated size of the first object, such as radar information and/or other information.Type: GrantFiled: January 5, 2021Date of Patent: October 4, 2022Assignee: QUALCOMM IncorporatedInventors: Jayakrishnan Unnikrishnan, Avdhut Joshi, Shivam Agarwal, Yoga Y Nadaraajan, Amir Salimi, Urs Niesen, Sree Sesha Aravind Vadrevu, Gautam Sachdeva
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Patent number: 11454949Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.Type: GrantFiled: January 23, 2019Date of Patent: September 27, 2022Assignee: KLA CorporationInventors: Shivam Agarwal, Hariharasudhan Koteeswaran, Priyank Jain, Suvi Murugan, Yuan Zhong
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Patent number: 11393118Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.Type: GrantFiled: June 9, 2020Date of Patent: July 19, 2022Assignee: KLA CORPORATIONInventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
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Publication number: 20210209785Abstract: Techniques and systems are provided for determining one or more sizes of one or more objects. For example, a bounding region identifying a first object detected in an image can be obtained. A map including map points can also be obtained. The map points correspond to one or more reference locations in a three-dimensional space. The bounding region identifying the first object can be associated with at least one map point of the map points included in the map. Using the bounding region and the at least one map point, an estimated three-dimensional position and an estimated size of the first object detected in the image can be determined. In some examples, other information can be used to estimate the estimated three-dimensional position and an estimated size of the first object, such as radar information and/or other information.Type: ApplicationFiled: January 5, 2021Publication date: July 8, 2021Inventors: Jayakrishnan UNNIKRISHNAN, Avdhut JOSHI, Shivam AGARWAL, Yoga Y NADARAAJAN, Amir SALIMI, Urs NIESEN, Sree Sesha Aravind VADREVU, Gautam SACHDEVA
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Patent number: 10957608Abstract: A wafer topography measurement system can be paired with a scanning electron microscope. A topography threshold can be applied to wafer topography data about the wafer, which was obtained with the wafer topography measurement system. A metrology sampling plan can be generated for the wafer. This metrology sampling plan can include locations in the wafer topography data above the topography threshold. The scanning electron microscope can scan the wafer using the metrology sampling plan and identify defects.Type: GrantFiled: November 16, 2017Date of Patent: March 23, 2021Assignee: KLA-Tencor CorporationInventors: Arpit Yati, Shivam Agarwal, Jagdish Saraswatula, Andrew Cross
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Publication number: 20200402252Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.Type: ApplicationFiled: June 9, 2020Publication date: December 24, 2020Inventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
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Publication number: 20200218913Abstract: Disclosed are techniques for determining a motion state of a target object. In an aspect, an on-board computer of an ego vehicle detects the target object in one or more images, determines one or more first attributes of the target object based on measurements of the one or more images, determines one or more second attributes of the target object based on measurements of a map of a roadway on which the target object is travelling, and determines the motion state of the target object based on the one or more first attributes and the one or more second attributes of the target object.Type: ApplicationFiled: January 2, 2020Publication date: July 9, 2020Inventors: Jayakrishnan UNNIKRISHNAN, Avdhut JOSHI, Shivam AGARWAL, Amir SALIMI, Sree Sesha Aravind VADREVU, Gautam SACHDEVA, Yoga Y NADARAAJAN, Ravi Teja SUKHAVASI, Aolin XU, Xinzhou WU, Young-Ki BAIK, Duck Hoon KIM, Hyun-Mook CHO
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Publication number: 20190302734Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.Type: ApplicationFiled: January 23, 2019Publication date: October 3, 2019Inventors: Shivam Agarwal, Hariharasudhan Koteeswaran, Priyank Jain, Suvi Murugan, Yuan Zhong
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Patent number: 10171358Abstract: Systems and methods for port congestion resiliency in a Link Aggregation Group (LAG) including a multi-card LAG and/or a multi-switch LAG. A method includes receiving a packet for egress over the LAG; responsive to determining no congestion over internal ports not part of the LAG, hashing with all member ports in the LAG in a distribution state; and, responsive to determining congestion over the internal ports, hashing with only member ports on a local card in which the packet was received, wherein the hashing determines which member port the packet egresses from in the LAG. The multi-card LAG includes multiple cards where packets ingress and egress from, and the cards communicate via a backplane port which is not part of the LAG. The multi-switch LAG includes multiple chassis where packets ingress and egress from, and the chassis communicate via an inter-switch connectivity port which is not part of the LAG.Type: GrantFiled: March 17, 2016Date of Patent: January 1, 2019Assignee: Ciena CorporationInventors: Anubhav Saksena, Rajeev Chandwani, Shivam Agarwal
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Publication number: 20180315670Abstract: A wafer topography measurement system can be paired with a scanning electron microscope. A topography threshold can be applied to wafer topography data about the wafer, which was obtained with the wafer topography measurement system. A metrology sampling plan can be generated for the wafer. This metrology sampling plan can include locations in the wafer topography data above the topography threshold. The scanning electron microscope can scan the wafer using the metrology sampling plan and identify defects.Type: ApplicationFiled: November 16, 2017Publication date: November 1, 2018Inventors: Arpit Yati, Shivam Agarwal, Jagdish Saraswatula, Andrew Cross
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Patent number: 10015101Abstract: Systems and methods for per queue per service buffering capability for traffic shaping include receiving an ingress packet; responsive to no traffic shaping, providing the ingress packet to an output interface; and, responsive to traffic shaping, performing one of sending the ingress packet to the output interface, buffering the ingress packet in a queue based on service priority, and dropping the ingress packet. The traffic shaping can include one of a token bucket algorithm and a leaky bucket algorithm.Type: GrantFiled: January 25, 2016Date of Patent: July 3, 2018Assignee: Ciena CorporationInventors: Shivam Agarwal, Himanshu Premi, Tushar Ruhela
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Publication number: 20180057071Abstract: A self-locating fastener tab for connecting a first vehicle element to a second vehicle element includes a body comprising a head portion and a flexible neck portion. The flexible neck portion includes a first neck length, a second neck length, and an intervening flexible length having a greater degree of flexibility than either of the first neck length and the second neck length. The intervening flexible length may define a living hinge.Type: ApplicationFiled: August 30, 2016Publication date: March 1, 2018Inventors: Jeffery Lee, Joseph Andrew Hickey, Steven Michael Lakatos, Justin Carroll, Jason Orville Gridley-Waters, Shivam Agarwal
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Patent number: 9838320Abstract: Packet metering systems and methods optimize utilization of green or committed tokens. The packet metering method includes receiving a packet of size B in an interval; and marking a color of the packet as green for committed, yellow for excess, or red for discard, based on the size B, a current committed token bucket for the interval, a current excess token bucket, and an overflow counter used to preserve unused green tokens from previous intervals while preserving Committed Information Rate (CIR) and Committed Burst Size (CBS) for the interval.Type: GrantFiled: February 25, 2016Date of Patent: December 5, 2017Assignee: Ciena CorporationInventor: Shivam Agarwal
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Patent number: 9807022Abstract: Packet metering systems and methods optimize utilization of yellow or excess tokens. The packet metering method includes receiving a packet of size B in an interval; and marking a color of the packet as green for committed, yellow for excess, or red for discard, based on the size B, a current committed token bucket for the interval, a current excess token bucket, and an overflow counter used to preserve unused yellow tokens from previous intervals while preserving Excess Information Rate (EIR) and Excess Burst Size (EBS) for the interval.Type: GrantFiled: September 15, 2015Date of Patent: October 31, 2017Assignee: Ciena CorporationInventor: Shivam Agarwal