Patents by Inventor Shivcharan V. Kamaraju

Shivcharan V. Kamaraju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a capped micro-electro-mechanical system (MEMS) device
    Patent number: 8039312
    Abstract: A capped micro-electro-mechanical systems (MEMS) device is formed using a device wafer and a cap wafer. The MEMS device is located on a frontside of the device wafer. A frontside of a cap wafer is attached to the frontside of the device wafer. A first stressor layer having a tensile stress is applied to a backside of the cap wafer after attaching the frontside of the cap wafer to the frontside of the device wafer. The first stressor layer and the cap wafer are patterned to form an opening through the first stressor layer and the cap wafer after applying the first stressor layer. A conductive layer is applied to the backside of the cap wafer, including through the opening to the frontside of the device wafer.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: October 18, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Veera M. Gunturu, Shivcharan V. Kamaraju, Lisa H. Karlin