Patents by Inventor Shivesh Langhanoja

Shivesh Langhanoja has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor device having printed circuit board substrate with built-in media channel
    Patent number: 11089688
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 10, 2021
    Assignee: TT ELECTRONICS PLC
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • SENSOR DEVICE HAVING PRINTED CIRCUIT BOARD SUBSTRATE WITH BUILT-IN MEDIA CHANNEL
    Publication number: 20190254168
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Sensor device having printed circuit board substrate with built-in media channel
    Patent number: 10285275
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: May 7, 2019
    Assignee: TT ELECTRONICS PLC
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Sensor device with media channel between substrates
    Patent number: 10163660
    Abstract: A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: December 25, 2018
    Assignee: TT ELECTRONICS PLC
    Inventors: Shivesh Langhanoja, Brent Hans Larson
  • Sensor Device Having Printed Circuit Board Substrate With Built-In Media Channel
    Publication number: 20180343745
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 29, 2018
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Sensor Device With Media Channel Between Substrates
    Publication number: 20180323083
    Abstract: A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.
    Type: Application
    Filed: May 8, 2017
    Publication date: November 8, 2018
    Inventors: Shivesh Langhanoja, Brent Hans Larson