Patents by Inventor Shiwen Liu
Shiwen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11951778Abstract: A sound absorber is configured as a rectangular hexahedral box and forms a porous double-layer Helmholtz resonance sound absorbing structure, at the same time, the sound absorber in the form of a box forms a structural resonance sound absorbing device itself, and the first-order natural mode frequency of the device is identical to that of a wheel air chamber. When the box-type sound absorbing structure is assembled in a wheel, double functions of absorbing acoustic resonance of the wheel air chamber under the organic combination of Helmholtz resonance sound absorption and structural resonance sound absorption can be realized.Type: GrantFiled: January 19, 2020Date of Patent: April 9, 2024Assignee: CITIC Dicastal Co., LTDInventors: Shiwen Xu, Mingbo Chen, Minglei Li, Shaobing Huang, Tiefeng Hu, Shuwei Feng, Dadong Wang, Weidong Liu
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Publication number: 20240113288Abstract: This application relates to a negative electrode plate, a secondary battery and apparatus thereof. The secondary battery of the present application comprises a negative electrode plate, the negative electrode plate comprises a composite current collector and a negative electrode active material layer disposed on at least one surface of the composite current collector, the negative electrode active material layer comprises a silicon-based active material, the silicon-based active material accounts for 0.5 wt % to 50 wt % of total mass of the negative electrode active material layer, and the composite current collector comprises a polymer support layer and a metal conductive layer disposed on at least one surface of the polymer support layer. The secondary battery and the negative electrode plate achieve good coordination between the current collector and the negative electrode active material layer.Type: ApplicationFiled: November 30, 2023Publication date: April 4, 2024Applicant: Contemporary Amperex Technology Co., LimitedInventors: Cheng LI, Qisen HUANG, Xin LIU, Changliang SHENG, Shiwen WANG, Xianghui LIU, Jia PENG, Mingling LI, Chengdu LIANG
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Patent number: 11815732Abstract: A liquid lens apparatus includes a first substrate and a sensor. The first substrate has first and second opposing surfaces, a central portion, and a peripheral portion outside of the central portion. The sensor is formed lithographically on either the first or second surfaces of the peripheral portion of the first substrate such that the sensor is on an exterior surface of the liquid lens apparatus. The sensor is configured to detect a temperature of the liquid lens apparatus to enable compensation for thermal expansion or contraction of the liquid lens apparatus resulting from changes in temperature of the liquid lens apparatus.Type: GrantFiled: July 30, 2020Date of Patent: November 14, 2023Assignees: CORNING INCORPORATED, LG INNOTEK CO. LTD.Inventors: Christian Daniel Gutleben, Shiwen Liu, Nicholas James Pfister, Ernesto Sanchez, Jr.
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Publication number: 20230098402Abstract: Providing multi-device services using a network application programming interface. The server obtains the accessibility in-ormation which indicates the plurality of devices and their capabilities. The plurality of devices have a same user identity. In this way, the server can take control on devices of participate for MuD services.Type: ApplicationFiled: February 3, 2020Publication date: March 30, 2023Inventor: Shiwen LIU
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Publication number: 20230091841Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.Type: ApplicationFiled: November 17, 2022Publication date: March 23, 2023Inventors: Kaveh Adib, Robert Alan Bellman, Jiangwei Feng, Georgiy M Guryanov, Jhih-Wei Liang, Shiwen Liu, Prantik Mazumder
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Patent number: 11577992Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.Type: GrantFiled: October 12, 2018Date of Patent: February 14, 2023Assignee: CORNING INCORPORATEDInventors: Robert Alan Bellman, David Francis Dawson-Elli, Shiwen Liu, Chuanche Wang
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Patent number: 11535553Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.Type: GrantFiled: August 29, 2017Date of Patent: December 27, 2022Assignee: Corning IncorporatedInventors: Kaveh Adib, Robert Alan Bellman, Jiangwei Feng, Georgiy M Guryanov, Jhih-Wei Liang, Shiwen Liu, Prantik Mazumder
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Publication number: 20220058305Abstract: A modeling method for a fan assembly includes constructing non-axially symmetric end wall curved surfaces in a cascade channel. Constructing the non-axially symmetric end wall curved surfaces in the cascade channel includes: determining, using a flow path design method for a dual flow path of a blade end area, an initial axially symmetric curve radius and a recessed curve lowest point radius of non-axially symmetric curved surfaces; and constructing the non-axially symmetric end wall curved surfaces in the cascade channel according to the initial axially symmetric curve radius and the recessed curve lowest point radius. The modeling method constructs the non-axially symmetric end wall curved surfaces in the cascade channel using the flow path design method for a dual flow path of a blade end area, to implement the control of flow directions by the non-axially symmetric curved surfaces, thereby reducing end wall loss.Type: ApplicationFiled: July 30, 2019Publication date: February 24, 2022Inventors: Xiaohe YANG, Xiaomeng PEI, Shiwen LIU
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Publication number: 20220035079Abstract: A liquid lens can include a chamber with first and second fluids and an interface between the fluids. A first electrode can be insulated from the fluids, and a second electrode can be in electrical communication with the first fluid. A position of the interface can be based at least in part on a voltage applied between the first and second electrodes. A flexure can be configured to cause a window to displace axially along an optical axis to change a volume of the chamber. The flexure can extend laterally outward from the window substantially linearly, and can be formed between a first recess on an outer side of the liquid lens and a second recess on an inner side of the liquid lens. The second recess can extend laterally outward farther than the first recess such that the first recess and the second recess are offset from each other.Type: ApplicationFiled: September 20, 2019Publication date: February 3, 2022Inventors: Raymond Miller Karam, Shiwen Liu, Christopher RC Olson, Ernesto Sanchez, Jr., Ming Ying
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Patent number: 11123954Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.Type: GrantFiled: March 14, 2018Date of Patent: September 21, 2021Assignee: CORNING INCORPORATEDInventors: Kaveh Adib, Robert Alan Bellman, Dana Craig Bookbinder, Theresa Chang, Shiwen Liu, Robert George Manley, Prantik Mazumder
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Patent number: 11114309Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.Type: GrantFiled: July 29, 2019Date of Patent: September 7, 2021Assignee: Corning IncorporatedInventors: Robert Alan Bellman, Shiwen Liu
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Publication number: 20210255370Abstract: A method of fabricating a liquid lens or an array of liquid lenses, and the corresponding liquid lens or array of lenses is disclosed. The method includes patterning an insulative layer (132) by photolithographic techniques to expose a portion of the conductive layer (124) and a portion of the insulative layer (132) having a surface energy below 40 mJ/m2. In further embodiments, the liquid lens includes an interface (110) forming a lens between a polar liquid (106) and a non-polar liquid (108) disposed within a cavity (104). The interface intersects a surface of the insulative layer (132) having a surface energy below 40 mJ/m2.Type: ApplicationFiled: May 15, 2019Publication date: August 19, 2021Inventors: Michael Anzlowar, Robert Alan Bellman, Shiwen Liu, Ines Wyrsta
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Publication number: 20210048602Abstract: A liquid lens apparatus includes a first substrate and a sensor. The first substrate has first and second opposing surfaces, a central portion, and a peripheral portion outside of the central portion. The sensor is formed lithographically on either the first or second surfaces of the peripheral portion of the first substrate such that the sensor is on an exterior surface of the liquid lens apparatus. The sensor is configured to detect a temperature of the liquid lens apparatus to enable compensation for thermal expansion or contraction of the liquid lens apparatus resulting from changes in temperature of the liquid lens apparatus.Type: ApplicationFiled: July 30, 2020Publication date: February 18, 2021Inventors: Christian Daniel Gutleben, Shiwen Liu, Nicholas James Pfister, Ernesto Sanchez, JR.
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Publication number: 20200262162Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.Type: ApplicationFiled: October 12, 2018Publication date: August 20, 2020Inventors: Robert Alan Bellman, David Francis Dawson-Elli, Shiwen Liu, ChuanChe Wang
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Publication number: 20200181009Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.Type: ApplicationFiled: August 29, 2017Publication date: June 11, 2020Inventors: Kaveh Adib, Robert Alan Bellman, Jiangwei Feng, Georgiy M Guryanov, Jhih-Wei Liang, Shiwen Liu, Prantik Mazumder
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Publication number: 20200058491Abstract: In various embodiments, a semiconductor device includes an aluminum nitride single-crystal substrate, a pseudomorphic strained layer disposed thereover that comprises at least one of AN, GaN, InN, or an alloy thereof, and, disposed over the strained layer, a semiconductor layer that is lattice-mismatched to the substrate and substantially relaxed.Type: ApplicationFiled: September 3, 2019Publication date: February 20, 2020Inventors: James R. Grandusky, Leo J. Schowalter, Shawn R. Gibb, Joseph A. Smart, Shiwen Liu
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Publication number: 20190348301Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.Type: ApplicationFiled: July 29, 2019Publication date: November 14, 2019Inventors: Robert Alan Bellman, Shiwen Liu
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Patent number: 10446391Abstract: In various embodiments, a semiconductor device includes an aluminum nitride single-crystal substrate, a pseudomorphic strained layer disposed thereover that comprises at least one of AlN, GaN, InN, or an alloy thereof, and, disposed over the strained layer, a semiconductor layer that is lattice-mismatched to the substrate and substantially relaxed.Type: GrantFiled: November 17, 2011Date of Patent: October 15, 2019Assignee: CRYSTAL IS, INC.Inventors: James R. Grandusky, Leo J. Schowalter, Shawn R. Gibb, Joseph A. Smart, Shiwen Liu
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Patent number: 10410883Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.Type: GrantFiled: May 31, 2017Date of Patent: September 10, 2019Assignee: Corning IncorporatedInventors: Robert Alan Bellman, Shiwen Liu
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Patent number: 10211579Abstract: A power plug is provided. The power plug may include a plug insert having a handle, and a plug body including a plurality of insulation layers and a plurality of conducting strips sandwiched between the pluralities of insulation layers. Each of the plurality of conducting strips may have an end extending into the handle and the other end forming or electrically connected to a conducting contact point exposed on a surface of the plug body.Type: GrantFiled: July 28, 2016Date of Patent: February 19, 2019Assignee: SHANUTEC (SHANGHAI) CO., LTD.Inventors: Wenting Zhu, Guoxin Wu, Nan Luo, Quangang Zhang, Bowei Lu, Yan Chen, Juan Cheng, Shiwen Liu, Furong Qiu, Jiajie Shen, Enhua Geng