Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: The present invention relates to a pre-vulcanized annular crown of an extra-large tire, and a preparation method and an application thereof. The annular crown includes shoulder extending edges, which extend from both sides of the crown to the central direction of the tire along shoulders, where the shoulder extending edges are provided with a structure of pattern blocks and pattern grooves, which extend from a tread to sidewalls and are suitable for the extra-large tire, and outer contour lines of sections of the shoulders and the shoulder extending edges are concave inwards. Pattern grooves in original shoulders can be completely removed when an old tire body is ground, and the crown structure and functional advantages of the extra-large tire which is retreaded can be fully given.

Abstract: A memory device includes a substrate, a controller die, a flip chip die, first and second silicon dies, and bond wires. The controller and flip chip dies are attached to the substrate using connection balls and in electrical communication with each other. The first and second silicon dies include respective first and second contact pad surfaces. The bond wires electrically connect the contact pad surfaces to the substrate so the first and second silicon dies communicate with the controller die. The flip chip die and first and second silicon dies are NAND dies, the flip chip die is configured as SLC memory, and the silicon dies are configured as one of MLC memory, TLC memory, or QLC memory.

Abstract: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.