Abstract: A light-emitting diode (LED) chip assembly and a preparing method thereof, and a preparing method of a display panel are provided. The LED chip assembly includes a patterned substrate, a patterned support layer, and multiple LED chips. The patterned substrate defines multiple through holes. The patterned support layer is disposed on a surface of the patterned substrate and attached to the patterned substrate. Each LED chip at least partially extends into each through hole. The each LED chip is partially embedded in the patterned support layer, and the each LED chip has a face surface away from the patterned support layer. The patterned support layer defines a hollow structure at a position opposite to a back surface of the each LED chip.